Conductive trace interconnection tape
Abstract
A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1893001
- Patent Number(s):
- 11350524
- Application Number:
- 17/067,901
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
- DOE Contract Number:
- NA0002839
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 10/12/2020
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Conductive trace interconnection tape. United States: N. p., 2022.
Web.
Hatch, Stephen McGarry, & Hatch, Jonathan Douglas. Conductive trace interconnection tape. United States.
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Tue .
"Conductive trace interconnection tape". United States. https://www.osti.gov/servlets/purl/1893001.
@article{osti_1893001,
title = {Conductive trace interconnection tape},
author = {Hatch, Stephen McGarry and Hatch, Jonathan Douglas},
abstractNote = {A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {5}
}
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