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Title: Counter gravity heat pipe techniques

Abstract

A pump assisted heat pipe may combine the low mass flow rate required of latent heat pipe transfer loops with a hermetically sealed pump to overcome the typical heat pipe capillary limit. This may result in a device with substantially higher heat transfer capacity over conventional pumped single-phase loops, heat pipes, loop heat pipes, and capillary pumped loops with very modest power requirements to operate. Further, one or more embodiments overcome the gravitation limitations in the conventional heat pipe configuration, e.g., when the heat addition zone is above the heat rejection zone, the capillary forces are required to transfer the liquid from the heat rejection zone to the heat addition zone against gravity.

Inventors:
; ; ; ; ; ; ; ;
Issue Date:
Research Org.:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1892959
Patent Number(s):
11340023
Application Number:
15/921,800
Assignee:
Triad National Security, LLC (Los Alamos, NM)
Patent Classifications (CPCs):
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
G - PHYSICS G21 - NUCLEAR PHYSICS G21C - NUCLEAR REACTORS
DOE Contract Number:  
AC52-06NA25396
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/15/2018
Country of Publication:
United States
Language:
English

Citation Formats

Reid, Robert S., Zimmerman, Robert A., Williams, Cody M., Biel, Morgan T., Obrey, Stephen J., Jankowski, Todd A., Simpson, Justin, Ward, Martin J., and Wermer, Lydia. Counter gravity heat pipe techniques. United States: N. p., 2022. Web.
Reid, Robert S., Zimmerman, Robert A., Williams, Cody M., Biel, Morgan T., Obrey, Stephen J., Jankowski, Todd A., Simpson, Justin, Ward, Martin J., & Wermer, Lydia. Counter gravity heat pipe techniques. United States.
Reid, Robert S., Zimmerman, Robert A., Williams, Cody M., Biel, Morgan T., Obrey, Stephen J., Jankowski, Todd A., Simpson, Justin, Ward, Martin J., and Wermer, Lydia. Tue . "Counter gravity heat pipe techniques". United States. https://www.osti.gov/servlets/purl/1892959.
@article{osti_1892959,
title = {Counter gravity heat pipe techniques},
author = {Reid, Robert S. and Zimmerman, Robert A. and Williams, Cody M. and Biel, Morgan T. and Obrey, Stephen J. and Jankowski, Todd A. and Simpson, Justin and Ward, Martin J. and Wermer, Lydia},
abstractNote = {A pump assisted heat pipe may combine the low mass flow rate required of latent heat pipe transfer loops with a hermetically sealed pump to overcome the typical heat pipe capillary limit. This may result in a device with substantially higher heat transfer capacity over conventional pumped single-phase loops, heat pipes, loop heat pipes, and capillary pumped loops with very modest power requirements to operate. Further, one or more embodiments overcome the gravitation limitations in the conventional heat pipe configuration, e.g., when the heat addition zone is above the heat rejection zone, the capillary forces are required to transfer the liquid from the heat rejection zone to the heat addition zone against gravity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {5}
}

Works referenced in this record:

Passive Device With Micro Capillary Pumped Fluid Loop
patent-application, August 2011


Evaporator and loop-type heat pipe using the same
patent, December 2001


Non-Inverted Meniscus Loop Heat Pipe/Capillary Pumped Loop Evaporator
patent-application, March 2003


Heat Transfer System For A Satellite Including An Evaporator
patent-application, March 2004


Capillary pumped loop body heat exchanger
patent, March 1998


Heat pipe evaporator with porous valve
patent, March 2006


Pump-assisted heat pipe
patent, September 1984


Capillary pump evaporator
patent, April 1994


Cooling device and an electronic apparatus including the same
patent-application, June 2005


Cooling apparatus and electronic apparatus
patent-application, June 2012