Non-permeable substrate carrier for electroplating
Abstract
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
- Inventors:
- Issue Date:
- Research Org.:
- SunPower Corp., San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1892728
- Patent Number(s):
- 11280019
- Application Number:
- 16/445,675
- Assignee:
- SunPower Corporation (San Jose, CA)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES C25D - PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- DOE Contract Number:
- FC36-07GO17043
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/19/2019
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, Ganti, Kalyana Bhargava, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States: N. p., 2022.
Web.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, Ganti, Kalyana Bhargava, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., & Castillo, Arnold Villamor. Non-permeable substrate carrier for electroplating. United States.
Abas, Emmanuel Chua, Chen, Chen-An, Ma, Diana Xiaobing, Ganti, Kalyana Bhargava, Divino, Edmundo Anida, Ermita, Jake Randal G., Capulong, Jose Francisco S., and Castillo, Arnold Villamor. Tue .
"Non-permeable substrate carrier for electroplating". United States. https://www.osti.gov/servlets/purl/1892728.
@article{osti_1892728,
title = {Non-permeable substrate carrier for electroplating},
author = {Abas, Emmanuel Chua and Chen, Chen-An and Ma, Diana Xiaobing and Ganti, Kalyana Bhargava and Divino, Edmundo Anida and Ermita, Jake Randal G. and Capulong, Jose Francisco S. and Castillo, Arnold Villamor},
abstractNote = {One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {3}
}
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