Title: Medium voltage planar DC bus distributed capacitor array

Abstract

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

Inventors:

Ravi, Lakshmi; Stewart, Joshua; Dong, Dong; Burgos, Rolando

Issue Date:

2022-03-08

Research Org.:

Virginia Polytechnic Inst. and State Univ. (Virginia Tech), Blacksburg, VA (United States)

Sponsoring Org.:

USDOE Office of Energy Efficiency and Renewable Energy (EERE)

OSTI Identifier:

1892699

Patent Number(s):

11271492

Application Number:

16/939,914

Assignee:

Virginia Tech Intellectual Properties, Inc. (Blacksburg, VA)

Patent Classifications (CPCs):

H - ELECTRICITY H02 - GENERATION H02M - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H02 - GENERATION H02M - APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS

H02M7/003 - {Constructional details, e.g. physical layout, assembly, wiring, busbar connections}
H02M7/5387 - in a bridge configuration

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K1/0219 - {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors}
H05K1/0256 - {Electrical insulation details, e.g. around high voltage areas}
H05K1/116 - {Lands, clearance holes or other lay-out details concerning the surrounding of a via}
H05K2201/052 - Branched
H05K2201/053 - Tails
H05K2201/09063 - Holes or slots in insulating substrate not used for electrical connections
H05K2201/093 - Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
H05K2201/09418 - Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
H05K2201/09718 - Clearance holes
H05K2201/09881 - Coating only between conductors, i.e. flush with the conductors
H05K2201/10015 - Non-printed capacitor
H05K2201/10022 - Non-printed resistor
H05K3/366 - {substantially perpendicularly to each other
H05K3/429 - {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}

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DOE Contract Number:  

EE0006521

Resource Type:

Patent

Resource Relation:

Patent File Date: 07/27/2020

Country of Publication:

United States

Language:

English