Self-alignment features for III-V ridge process and angled facet die
Abstract
A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1892584
- Patent Number(s):
- 11239631
- Application Number:
- 16/584,218
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
- DOE Contract Number:
- AR0000540
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 09/26/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States: N. p., 2022.
Web.
Barwicz, Tymon, Martin, Yves C., & Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States.
Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Tue .
"Self-alignment features for III-V ridge process and angled facet die". United States. https://www.osti.gov/servlets/purl/1892584.
@article{osti_1892584,
title = {Self-alignment features for III-V ridge process and angled facet die},
author = {Barwicz, Tymon and Martin, Yves C. and Orcutt, Jason S.},
abstractNote = {A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {2}
}
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