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Title: Method for gas bubble and void control and removal from metals

A method is described for enhancing the diffusion of gas bubbles or voids attached to impurity precipitates, and biasing their direction of migration out of the host metal (or metal alloy) by applying a temperature gradient across the host metal (or metal alloy). In the preferred embodiment of the present invention, the impurity metal is insoluble in the host metal and has a melting point lower than the melting point of the host material. Also, preferably the impurity metal is lead or indium and the host metal is aluminum or a metal alloy. 2 figs.
Inventors:
;
Issue Date:
OSTI Identifier:
187056
Assignee:
Lockheed Idaho Technologies Co., Idaho Falls, ID (United States) PTO; SCA: 360101; PA: EDB-96:036911; SN: 96001532295
Patent Number(s):
US 5,490,187/A/
Application Number:
PAN: 8-259,201
Contract Number:
AC07-76ID01570
Resource Relation:
Other Information: PBD: 6 Feb 1996
Research Org:
EG & G Idaho Inc
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; METALS; HEAT TREATMENTS; REFINING; ALLOYS; LEAD; REMOVAL; INDIUM; ALUMINIUM; INCLUSIONS; IMPURITIES; DIFFUSION; MELTING POINTS

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