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Title: System and method for large-scale PCB production including continuous selective adhesion

Abstract

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

Inventors:
;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1860154
Patent Number(s):
11197401
Application Number:
16/253,296
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/22/2019
Country of Publication:
United States
Language:
English

Citation Formats

Hatch, Jonathan Douglas, and Hatch, Stephen McGarry. System and method for large-scale PCB production including continuous selective adhesion. United States: N. p., 2021. Web.
Hatch, Jonathan Douglas, & Hatch, Stephen McGarry. System and method for large-scale PCB production including continuous selective adhesion. United States.
Hatch, Jonathan Douglas, and Hatch, Stephen McGarry. Tue . "System and method for large-scale PCB production including continuous selective adhesion". United States. https://www.osti.gov/servlets/purl/1860154.
@article{osti_1860154,
title = {System and method for large-scale PCB production including continuous selective adhesion},
author = {Hatch, Jonathan Douglas and Hatch, Stephen McGarry},
abstractNote = {A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {12}
}

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