Runtime localized cooling of high-performance processors

Rao, Karthik; Huang, Wei; An, Xudong; Arora, Manish; Greathouse, Joseph L.

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Title: Runtime localized cooling of high-performance processors

Abstract

A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.

Inventors:: Rao, Karthik; Huang, Wei; An, Xudong; Arora, Manish; Greathouse, Joseph L.

Issue Date:: 2021-10-05

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States); Advanced Micro Devices, Inc., Santa Clara, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1859918

Patent Number(s):: 11137809

Application Number:: 16/228,036

Assignee:: Advanced Micro Devices, Inc. (Santa Clara, CA)

Patent Classifications (CPCs):: G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02D - CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWN ENERGY USE

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G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
G06F1/206 - {comprising thermal management}
G06F1/26 - Power supply means, e.g. regulation thereof

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE Y02D - CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWN ENERGY USE
Y02D10/00 - Energy efficient computing

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DOE Contract Number:: AC52-07NA27344; B620717

Resource Type:: Patent

Resource Relation:: Patent File Date: 12/20/2018

Country of Publication:: United States

Language:: English

Citation Formats


                    Rao, Karthik, Huang, Wei, An, Xudong, Arora, Manish, and Greathouse, Joseph L. Runtime localized cooling of high-performance processors.  United States: N. p., 2021. 
        Web.

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                    Rao, Karthik, Huang, Wei, An, Xudong, Arora, Manish, & Greathouse, Joseph L. Runtime localized cooling of high-performance processors.  United States.

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                    Rao, Karthik, Huang, Wei, An, Xudong, Arora, Manish, and Greathouse, Joseph L. Tue .  
        "Runtime localized cooling of high-performance processors".  United States.  https://www.osti.gov/servlets/purl/1859918.

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@article{osti_1859918,

  title        = {Runtime localized cooling of high-performance processors},

  author       = {Rao, Karthik and Huang, Wei and An, Xudong and Arora, Manish and Greathouse, Joseph L.},

  abstractNote = {A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2021},

  month        = {10}

}

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Similar Records

Title: Runtime localized cooling of high-performance processors

Abstract

Citation Formats

Nanoscale Thermal Transport and Microrefrigerators on a Chip journal, August 2006

Adaptive Thermoelectric Cooling In A Processor patent-application, March 2015

Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots journal, January 2015

Platform-dependent, leakage-aware control of the driving current of embedded thermoelectric coolers conference, September 2013

TECfan: Coordinating Thermoelectric Cooler, Fan, and DVFS for CMP Energy Optimization conference, May 2016

Hybrid Solid State/Fluidic Cooling for Hot Spot Removal journal, July 2009

Devices including composite thermal capacitor patent-application, November 2012

Computer system having controlled cooling patent, March 2009

Microarchitecture Controller For Thin-Film Thermoelectric Cooling patent-application, March 2011

Hotspot Cooling in Stacked Chips Using Thermoelectric Coolers journal, May 2013

Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal conference, March 2012

Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle patent, November 2007

Package-on-Package (POP) Device Comprising Bi-Directional Thermal Electric Cooler patent-application, November 2016

Thermoelectric-based sustainable self-cooling for fine-grained processor hot spots conference, May 2016

Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator patent, November 2007

System employing temporal integration of thermoelectric action patent, January 2009

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor journal, July 2014

Heat dissipation device of serve patent-application, January 2005

Reducing Power Consumption Of Uncore Circuitry Of A Processor patent-application, December 2012

Fighting fire with fire journal, June 2011

Nanoscale Thermal Transport and Microrefrigerators on a Chip
journal, August 2006

Adaptive Thermoelectric Cooling In A Processor
patent-application, March 2015

Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots
journal, January 2015

Platform-dependent, leakage-aware control of the driving current of embedded thermoelectric coolers
conference, September 2013

TECfan: Coordinating Thermoelectric Cooler, Fan, and DVFS for CMP Energy Optimization
conference, May 2016

Hybrid Solid State/Fluidic Cooling for Hot Spot Removal
journal, July 2009

Devices including composite thermal capacitor
patent-application, November 2012

Computer system having controlled cooling
patent, March 2009

Microarchitecture Controller For Thin-Film Thermoelectric Cooling
patent-application, March 2011

Hotspot Cooling in Stacked Chips Using Thermoelectric Coolers
journal, May 2013

Energy efficient liquid-thermoelectric hybrid cooling for hot-spot removal
conference, March 2012

Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle
patent, November 2007

Package-on-Package (POP) Device Comprising Bi-Directional Thermal Electric Cooler
patent-application, November 2016

Thermoelectric-based sustainable self-cooling for fine-grained processor hot spots
conference, May 2016

Thermoelectric configuration employing thermal transfer fluid flow(s) with recuperator
patent, November 2007

System employing temporal integration of thermoelectric action
patent, January 2009

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
journal, July 2014

Heat dissipation device of serve
patent-application, January 2005

Reducing Power Consumption Of Uncore Circuitry Of A Processor
patent-application, December 2012

Fighting fire with fire
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