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Title: Burst resistant thin wall heat sink

Abstract

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1840493
Patent Number(s):
11131506
Application Number:
16/257,584
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL B21D - WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
B601996; B604142
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/25/2019
Country of Publication:
United States
Language:
English

Citation Formats

Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Burst resistant thin wall heat sink. United States: N. p., 2021. Web.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. Burst resistant thin wall heat sink. United States.
Coteus, Paul W., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue . "Burst resistant thin wall heat sink". United States. https://www.osti.gov/servlets/purl/1840493.
@article{osti_1840493,
title = {Burst resistant thin wall heat sink},
author = {Coteus, Paul W. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},
abstractNote = {An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {9}
}

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