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Title: Method for tuning thermal expansion properties in an additive manufacturing feedstock material

Abstract

A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.

Inventors:
Issue Date:
Research Org.:
Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1840442
Patent Number(s):
11118249
Application Number:
15/717,265
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B28 - WORKING CEMENT, CLAY, OR STONE B28B - SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
DOE Contract Number:  
NA0003525
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/27/2017
Country of Publication:
United States
Language:
English

Citation Formats

Burtch, Nicholas C. Method for tuning thermal expansion properties in an additive manufacturing feedstock material. United States: N. p., 2021. Web.
Burtch, Nicholas C. Method for tuning thermal expansion properties in an additive manufacturing feedstock material. United States.
Burtch, Nicholas C. Tue . "Method for tuning thermal expansion properties in an additive manufacturing feedstock material". United States. https://www.osti.gov/servlets/purl/1840442.
@article{osti_1840442,
title = {Method for tuning thermal expansion properties in an additive manufacturing feedstock material},
author = {Burtch, Nicholas C.},
abstractNote = {A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {9}
}

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