Hybrid chip-on-board LED module with patterned encapsulation
Abstract
Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.
- Inventors:
- Issue Date:
- Research Org.:
- Lumileds LLC, San Jose, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1840298
- Patent Number(s):
- 11075327
- Application Number:
- 16/690,837
- Assignee:
- Lumileds LLC (San Jose, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
- DOE Contract Number:
- EE0005099
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/21/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States: N. p., 2021.
Web.
Soer, Wouter Anthon, Helbing, Rene, & Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States.
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Tue .
"Hybrid chip-on-board LED module with patterned encapsulation". United States. https://www.osti.gov/servlets/purl/1840298.
@article{osti_1840298,
title = {Hybrid chip-on-board LED module with patterned encapsulation},
author = {Soer, Wouter Anthon and Helbing, Rene and Huang, Guan},
abstractNote = {Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {7}
}
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