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Title: Hybrid chip-on-board LED module with patterned encapsulation

Abstract

Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.

Inventors:
; ;
Issue Date:
Research Org.:
Lumileds LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1840298
Patent Number(s):
11075327
Application Number:
16/690,837
Assignee:
Lumileds LLC (San Jose, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
DOE Contract Number:  
EE0005099
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/21/2019
Country of Publication:
United States
Language:
English

Citation Formats

Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States: N. p., 2021. Web.
Soer, Wouter Anthon, Helbing, Rene, & Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States.
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Tue . "Hybrid chip-on-board LED module with patterned encapsulation". United States. https://www.osti.gov/servlets/purl/1840298.
@article{osti_1840298,
title = {Hybrid chip-on-board LED module with patterned encapsulation},
author = {Soer, Wouter Anthon and Helbing, Rene and Huang, Guan},
abstractNote = {Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {7}
}

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Surface-Textured Encapsulations for use with Light Emitting Diodes
patent-application, December 2011


Hybrid chip-on-board LED module with patterned encapsulation
patent, November 2019


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patent-application, June 2012


Light device and its light emitting diode module
patent-application, October 2013


Hybrid chip-on-board LED module with patterned encapsulation
patent, February 2018


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patent-application, October 2013


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patent-application, April 2014


Light-Emitting Device Array With Individual Cells
patent-application, December 2010


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patent-application, August 2014


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patent-application, January 2013


Process for producing optical semiconductor device
patent-application, September 2005


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patent-application, April 2016


LED packages with scattering particle regions
patent-application, January 2011