Title: Oscillating heat pipe integrated thermal management system for power electronics

Abstract

Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

Inventors:

Wang, Jim; Dwari, Suman

Issue Date:

2021-06-29

Research Org.:

Hamilton Sunstrand Corp., Charlotte, NC (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1824139

Patent Number(s):

11051428

Application Number:

16/670,043

Assignee:

Hamilton Sunstrand Corporation (Charlotte, NC)

Patent Classifications (CPCs):

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

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F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT

F28D15/0275 - {Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks
F28D15/043 - {forming loops, e.g. capillary pumped loops}

F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F13/10 - by imparting a pulsating motion to the flow, e.g. by sonic vibration

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L23/427 - Cooling by change of state, e.g. use of heat pipes {
H01L25/072 - {the devices being arranged next to each other}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

H05K7/20327 - {Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds}
H05K7/20336 - {Heat pipes, e.g. wicks or capillary pumps}
H05K7/20936 - {Liquid coolant with phase change}

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DOE Contract Number:  

AR0000889

Resource Type:

Patent

Resource Relation:

Patent File Date: 10/31/2019

Country of Publication:

United States

Language:

English