Thermocouple assembly

Schwarting, Nelson; Lashway, Brian J.; Crowley, John; Rappold, Don

Title: Thermocouple assembly

Full Record
Other Related Research

Abstract

Disclosed is a thermocouple assembly having a resilient mount; a buffer having a first side and a second side, with the buffer first side connecting with the resilient mount; an insulator having a first side and a second side, with the insulator first side connecting with the buffer second side; and a thermocouple having a first side and a second side, the thermocouple first side connecting with the insulator second side, and the thermocouple second side being configured to be in thermal contact with an object to be measured.

Inventors:: Schwarting, Nelson; Lashway, Brian J.; Crowley, John; Rappold, Don

Issue Date:: 2021-05-18

Research Org.:: US Dept. of Energy, Washington, DC (United States); Bechtel Marine Propulsion Corp., San Francisco, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1823971

Patent Number(s):: 11009402

Application Number:: 15/980,875

Assignee:: U.S. Department of Energy (Washington, DC)

DOE Contract Number:: NR0000031

Resource Type:: Patent

Resource Relation:: Patent File Date: 05/16/2018

Country of Publication:: United States

Language:: English

Citation Formats


                    Schwarting, Nelson, Lashway, Brian J., Crowley, John, and Rappold, Don. Thermocouple assembly.  United States: N. p., 2021. 
        Web.

Copy to clipboard


                    Schwarting, Nelson, Lashway, Brian J., Crowley, John, & Rappold, Don. Thermocouple assembly.  United States.

Copy to clipboard


                    Schwarting, Nelson, Lashway, Brian J., Crowley, John, and Rappold, Don. Tue .  
        "Thermocouple assembly".  United States.  https://www.osti.gov/servlets/purl/1823971.

Copy to clipboard


                    
@article{osti_1823971,

  title        = {Thermocouple assembly},

  author       = {Schwarting, Nelson and Lashway, Brian J. and Crowley, John and Rappold, Don},

  abstractNote = {Disclosed is a thermocouple assembly having a resilient mount; a buffer having a first side and a second side, with the buffer first side connecting with the resilient mount; an insulator having a first side and a second side, with the insulator first side connecting with the buffer second side; and a thermocouple having a first side and a second side, the thermocouple first side connecting with the insulator second side, and the thermocouple second side being configured to be in thermal contact with an object to be measured.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2021},

  month        = {5}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE Patents and OSTI.GOV collections:

Thermocouple assembly

Patent Thermos, Anthony Constantine [Greer, SC]; Rahal, Fadi Elias [Easley, SC]

A thermocouple assembly includes a thermocouple; a plurality of lead wires extending from the thermocouple; an insulating jacket extending along and enclosing the plurality of leads; and at least one internally sealed area within the insulating jacket to prevent fluid leakage along and within the insulating jacket. The invention also provides a method of preventing leakage of a fluid along and through an insulating jacket of a thermocouple including the steps of a) attaching a plurality of lead wires to a thermocouple; b) adding a heat sensitive pseudo-wire to extend along the plurality of lead wires; c) enclosing the leadmore » « less
Full Text Available
Temperature monitoring device and thermocouple assembly therefor

Patent Grimm, Noel P [Monroeville, PA]; Bauer, Frank I [Perry Township, Lawrence County, PA]; Bengel, Thomas G [Plum Boro, PA]; ...

A temperature monitoring device for measuring the temperature at a surface of a body, composed of: at least one first thermocouple and a second thermocouple; support members supporting the thermocouples for placing the first thermocouple in contact with the body surface and for maintaining the second thermocouple at a defined spacing from the body surface; and a calculating circuit connected to the thermocouples for receiving individual signals each representative of the temperature reading produced by a respective one of the first and second thermocouples and for producing a corrected temperature signal having a value which represents the temperature of themore » « less
Full Text Available
Turbine nozzle stage having thermocouple guide tube

Patent Schotsch, Margaret Jones [Greer, SC]; Kirkpatrick, Francis Lawrence [late of Galway, NY]; Lapine, Eric Michael [Northwood, NH]

A guide tube is fixed adjacent opposite ends in outer and inner covers of a nozzle stage segment. The guide tube is serpentine in shape between the outer and inner covers and extends through a nozzle vane. An insert is disposed in the nozzle vane and has apertures to accommodate serpentine portions of the guide tube. Cooling steam is also supplied through chambers of the insert on opposite sides of a central insert chamber containing the guide tube. The opposite ends of the guide tube are fixed to sleeves, in turn fixed to the outer and inner covers.
Full Text Available
Method of preventing leakage of a fluid along and through an insulating jacket of a thermocouple

Patent Thermos, Anthony Constantine [Greer, SC]; Rahal, Fadi Elias [Easley, SC]

A thermocouple assembly includes a thermocouple; a plurality of lead wires extending from the thermocouple; an insulating jacket extending along and enclosing the plurality of leads; and at least one internally sealed area within the insulating jacket to prevent fluid leakage along and within the insulating jacket. The invention also provides a method of preventing leakage of a fluid along and through an insulating jacket of a thermocouple including the steps of a) attaching a plurality of lead wires to a thermocouple; b) adding a heat sensitive pseudo-wire to extend along the plurality of lead wires; c) enclosing the leadmore » « less
Full Text Available
Method for bonding thin film thermocouples to ceramics

Patent Kreider, Kenneth G [Potomac, MD]

A method is provided for adhering a thin film metal thermocouple to a ceramic substrate used in an environment up to 700 degrees Centigrade, such as at a cylinder of an internal combustion engine. The method includes the steps of: depositing a thin layer of a reactive metal on a clean ceramic substrate; and depositing thin layers of platinum and a platinum-10% rhodium alloy forming the respective legs of the thermocouple on the reactive metal layer. The reactive metal layer serves as a bond coat between the thin noble metal thermocouple layers and the ceramic substrate. The thin layers ofmore » « less
Full Text Available

Similar Records