Electronic assembly having sectional thermal management

Schmit, Christopher J.

Title: Electronic assembly having sectional thermal management

Abstract

The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.

Inventors:: Schmit, Christopher J.

Issue Date:: 2021-05-11

Research Org.:: Deere & Co., Moline, IL (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1823954

Patent Number(s):: 11006513

Application Number:: 16/706,076

Assignee:: Deere & Company (Moline, IL)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L23/473 - by flowing liquids {

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0207 - {using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes}
H05K1/181 - {associated with surface mounted components}
H05K2201/062 - Means for thermal insulation, e.g. for protection of parts
H05K2201/064 - Fluid cooling, e.g. by integral pipes
H05K2201/10015 - Non-printed capacitor
H05K2201/10053 - Switch
H05K7/20409 - {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}
H05K7/205 - {Thermal paths through the printed circuit board [PCB]
H05K7/20518 - {Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots}
H05K7/209 - {Heat transfer by conduction from internal heat source to heat radiating structure
H05K7/20927 - {Liquid coolant without phase change}

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DOE Contract Number:: EE0006521

Resource Type:: Patent

Resource Relation:: Patent File Date: 12/06/2019

Country of Publication:: United States

Language:: English

Citation Formats


                    Schmit, Christopher J. Electronic assembly having sectional thermal management.  United States: N. p., 2021. 
        Web.

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                    Schmit, Christopher J. Electronic assembly having sectional thermal management.  United States.

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                    Schmit, Christopher J. Tue .  
        "Electronic assembly having sectional thermal management".  United States.  https://www.osti.gov/servlets/purl/1823954.

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@article{osti_1823954,

  title        = {Electronic assembly having sectional thermal management},

  author       = {Schmit, Christopher J.},

  abstractNote = {The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2021},

  month        = {5}

}

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Works referenced in this record:

Flexible circuit board interconnect having low thermal conductivity
patent, April 1985

Boros, John Paul
US Patent Document 4,509,095
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4509095

Break away, high speed, folded, jumperless electronic assembly
patent, July 2004

Smith, Gary W.
US Patent Document 6,762,942
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6762942

Thermal isolation in printed circuit board assemblies
patent, January 2016

Zhang, Yang; Steenstra, Jack
US Patent Document 9,232,640
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Motor-drive unit having heat radiator
patent, October 2015

Masuda, Naoki; Inaba, Kiichi
US Patent Document 9,155,231
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Packaging of a DC-to-DC converter
patent, April 2001

Dinh, James S.
US Patent Document 6,212,086
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6212086

Electrical circuit assembly for high-power electronics
patent, March 2011

Stahlhut, Ronnie Dean; Godbold, Clement Vanden; Hopman, Jeffrey Gerald
US Patent Document 7,903,417
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7903417

Flexible circuit board interconnection and methods
patent, October 2014

Holec, Henry V.; Crandell, Wm. Todd; Holec, Eric Henry
US Patent Document 8,851,356
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8851356

Method for connecting printed circuit boards and connected printed circuit boards
patent-application, May 2003

Miyake, Toshihiro; Deguchi, Kazuyuki; Yazaki, Yoshitaro
US Patent Application 10/284414; 20030079341
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20030079341

Thermal isolation techniques
patent, May 2016

Dean, Jr., David L.; Ellis, Robert W.
US Patent Document 9,348,377
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9348377

Electrical Circuit Connector with Resilient Pressure Pads
patent-application, September 2002

Yatskov, Alexander I.; Hellriegel, Stephen V. R.
US Patent Application 09/797791; 20020123259
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20020123259

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Title: Electronic assembly having sectional thermal management

Abstract

Citation Formats

Flexible circuit board interconnect having low thermal conductivity patent, April 1985

Break away, high speed, folded, jumperless electronic assembly patent, July 2004

Thermal isolation in printed circuit board assemblies patent, January 2016

Motor-drive unit having heat radiator patent, October 2015

Packaging of a DC-to-DC converter patent, April 2001

Electrical circuit assembly for high-power electronics patent, March 2011

Flexible circuit board interconnection and methods patent, October 2014

Method for connecting printed circuit boards and connected printed circuit boards patent-application, May 2003

Thermal isolation techniques patent, May 2016

Electrical Circuit Connector with Resilient Pressure Pads patent-application, September 2002

Flexible circuit board interconnect having low thermal conductivity
patent, April 1985

Break away, high speed, folded, jumperless electronic assembly
patent, July 2004

Thermal isolation in printed circuit board assemblies
patent, January 2016

Motor-drive unit having heat radiator
patent, October 2015

Packaging of a DC-to-DC converter
patent, April 2001

Electrical circuit assembly for high-power electronics
patent, March 2011

Flexible circuit board interconnection and methods
patent, October 2014

Method for connecting printed circuit boards and connected printed circuit boards
patent-application, May 2003

Thermal isolation techniques
patent, May 2016

Electrical Circuit Connector with Resilient Pressure Pads
patent-application, September 2002