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Title: Flexible sensor technology

Abstract

A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.

Inventors:
; ;
Issue Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1805555
Patent Number(s):
10932360
Application Number:
16/514,868
Assignee:
UT-Battelle, LLC (Oak Ridge, TN)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01R - MEASURING ELECTRIC VARIABLES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
AC05-00OR22725
Resource Type:
Patent
Resource Relation:
Patent File Date: 07/17/2019
Country of Publication:
United States
Language:
English

Citation Formats

Joshi, Pooran Chandra, Killough, Stephen M., and Kuruganti, Phani Teja. Flexible sensor technology. United States: N. p., 2021. Web.
Joshi, Pooran Chandra, Killough, Stephen M., & Kuruganti, Phani Teja. Flexible sensor technology. United States.
Joshi, Pooran Chandra, Killough, Stephen M., and Kuruganti, Phani Teja. Tue . "Flexible sensor technology". United States. https://www.osti.gov/servlets/purl/1805555.
@article{osti_1805555,
title = {Flexible sensor technology},
author = {Joshi, Pooran Chandra and Killough, Stephen M. and Kuruganti, Phani Teja},
abstractNote = {A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {2}
}

Works referenced in this record:

Printed circuit board-based current sensor
patent, May 2004


Enhanced cost effective method for high current measurements
patent, September 2005


Flexible current sensor arrangement
patent, November 2016


Coreless current sensor
patent, November 2005


System, Device, and Method of Three Dimensional Printing
patent-application, July 2015


Wireless Sensor Platform
patent-application, May 2016


Battery current sensor having a magnetic field sensor
patent, January 2017


System for detecting faults in electrical wiring, and manufacturing method thereof
patent, August 2014


Device, Method, and System of Three-Dimensional Printing
patent-application, July 2015


Current Sensor
patent-application, August 2016