Flexible sensor technology
Abstract
A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.
- Inventors:
- Issue Date:
- Research Org.:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1805555
- Patent Number(s):
- 10932360
- Application Number:
- 16/514,868
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- DOE Contract Number:
- AC05-00OR22725
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 07/17/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Joshi, Pooran Chandra, Killough, Stephen M., and Kuruganti, Phani Teja. Flexible sensor technology. United States: N. p., 2021.
Web.
Joshi, Pooran Chandra, Killough, Stephen M., & Kuruganti, Phani Teja. Flexible sensor technology. United States.
Joshi, Pooran Chandra, Killough, Stephen M., and Kuruganti, Phani Teja. Tue .
"Flexible sensor technology". United States. https://www.osti.gov/servlets/purl/1805555.
@article{osti_1805555,
title = {Flexible sensor technology},
author = {Joshi, Pooran Chandra and Killough, Stephen M. and Kuruganti, Phani Teja},
abstractNote = {A system and method (referred to as a method) to fabricate sensors and electronic circuits. The method prints a first thin-film having an electronic conductivity of about less than a millionth of a Siemens per meter and a permalloy directly onto the first thin-film. The permalloy has a magnetic permeability greater than a predetermined level and has a thickness within a range of about 1 to 20 microns. The system prints a second thin-film directly onto the permalloy to encapsulate the permalloy onto the first thin-film and prints conductive traces directly onto the surfaces of the first-thin-film, the permalloy, and the second thin-film. In some applications, a sensor is packaged in an additively manufactured three-dimensional cylindrical shape that can be mounted on or is a unitary part of a current carrying conductor without incising, sharing, or severing (e.g., cutting) the current carrying conductor or its insulation.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2021},
month = {2}
}