Ion beam mill etch depth monitoring with nanometer-scale resolution

Cybart, Shane A.; Dynes, Robert C.

Title: Ion beam mill etch depth monitoring with nanometer-scale resolution

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Abstract

A method for measuring conductance of a material real-time during etching/milling includes providing a fixture having a socket for receiving the material. The socket is attached to a printed circuit board (PCB) mounted on one side of a plate that has at least one opening for providing ion beam access to the material sample. Conductive probes extend from the other side of the PCB to contact and span a target area of the material. A measurement circuit in electrical communication with the probes measures the voltage produced when a current is applied across the material sample to measure changes in electrical properties of the sample over time.

Inventors:: Cybart, Shane A.; Dynes, Robert C.

Issue Date:: 2021-01-19

Research Org.:: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1805403

Patent Number(s):: 10896803

Application Number:: 15/681,210

Assignee:: The Regents of the University of California (Oakland, CA)

DOE Contract Number:: AC02-05CH11231

Resource Type:: Patent

Resource Relation:: Patent File Date: 08/18/2017

Country of Publication:: United States

Language:: English

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                    Cybart, Shane A., and Dynes, Robert C. Ion beam mill etch depth monitoring with nanometer-scale resolution.  United States: N. p., 2021. 
        Web.

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                    Cybart, Shane A., & Dynes, Robert C. Ion beam mill etch depth monitoring with nanometer-scale resolution.  United States.

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                    Cybart, Shane A., and Dynes, Robert C. Tue .  
        "Ion beam mill etch depth monitoring with nanometer-scale resolution".  United States.  https://www.osti.gov/servlets/purl/1805403.

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@article{osti_1805403,

  title        = {Ion beam mill etch depth monitoring with nanometer-scale resolution},

  author       = {Cybart, Shane A. and Dynes, Robert C.},

  abstractNote = {A method for measuring conductance of a material real-time during etching/milling includes providing a fixture having a socket for receiving the material. The socket is attached to a printed circuit board (PCB) mounted on one side of a plate that has at least one opening for providing ion beam access to the material sample. Conductive probes extend from the other side of the PCB to contact and span a target area of the material. A measurement circuit in electrical communication with the probes measures the voltage produced when a current is applied across the material sample to measure changes in electrical properties of the sample over time.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2021},

  month        = {1}

}

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