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Title: Laminated magnetic materials for on-chip magnetic inductors/transformers

Abstract

A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.

Inventors:
; ; ; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735297
Patent Number(s):
10784045
Application Number:
14/854,523
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
B601996
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/15/2015
Country of Publication:
United States
Language:
English

Citation Formats

Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, and Yoon, Joonah. Laminated magnetic materials for on-chip magnetic inductors/transformers. United States: N. p., 2020. Web.
Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, & Yoon, Joonah. Laminated magnetic materials for on-chip magnetic inductors/transformers. United States.
Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, and Yoon, Joonah. Tue . "Laminated magnetic materials for on-chip magnetic inductors/transformers". United States. https://www.osti.gov/servlets/purl/1735297.
@article{osti_1735297,
title = {Laminated magnetic materials for on-chip magnetic inductors/transformers},
author = {Deligianni, Hariklia and Gallagher, William J. and Kitayaporn, Sathana and O'Sullivan, Eugene J. and Romankiw, Lubomyr T. and Wang, Naigang and Yoon, Joonah},
abstractNote = {A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {9}
}

Works referenced in this record:

RF Magnetic Properties of FeCoB/Al$_{2}$O$_{3}$/FeCoB Structure With Varied Al$_{2}$O$_{3}$ Thickness
journal, October 2011


The activation effect of Pd nanoparticles on electroless nickel–phosphorous deposition
journal, October 2006


Micromagnetics of laminated Permalloy films
journal, May 1988


Electrodeposition of NiP Film used as a Nonmagnetic Spacer in Laminated (CoFe/NiP)n Writer Pole
journal, August 2009