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Title: Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts

Abstract

According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.

Inventors:
;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735288
Patent Number(s):
10781315
Application Number:
15/367,069
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
C - CHEMISTRY C07 - ORGANIC CHEMISTRY C07C - ACYCLIC OR CARBOCYCLIC COMPOUNDS
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 12/01/2016
Country of Publication:
United States
Language:
English

Citation Formats

Saha, Sourabh Kumar, and Oakdale, James Spencer. Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts. United States: N. p., 2020. Web.
Saha, Sourabh Kumar, & Oakdale, James Spencer. Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts. United States.
Saha, Sourabh Kumar, and Oakdale, James Spencer. Tue . "Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts". United States. https://www.osti.gov/servlets/purl/1735288.
@article{osti_1735288,
title = {Optically clear photo-polymerization resists for additive manufacturing of radiopaque parts},
author = {Saha, Sourabh Kumar and Oakdale, James Spencer},
abstractNote = {According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {9}
}

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