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Title: Laminated magnetic materials for on-chip magnetic inductors/transformers

Abstract

A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.

Inventors:
; ; ; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735213
Patent Number(s):
10763038
Application Number:
14/950,364
Assignee:
International Business Machines Corporation (Armonk, NY)
DOE Contract Number:  
B601996
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/24/2015
Country of Publication:
United States
Language:
English

Citation Formats

Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, and Yoon, Joonah. Laminated magnetic materials for on-chip magnetic inductors/transformers. United States: N. p., 2020. Web.
Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, & Yoon, Joonah. Laminated magnetic materials for on-chip magnetic inductors/transformers. United States.
Deligianni, Hariklia, Gallagher, William J., Kitayaporn, Sathana, O'Sullivan, Eugene J., Romankiw, Lubomyr T., Wang, Naigang, and Yoon, Joonah. Tue . "Laminated magnetic materials for on-chip magnetic inductors/transformers". United States. https://www.osti.gov/servlets/purl/1735213.
@article{osti_1735213,
title = {Laminated magnetic materials for on-chip magnetic inductors/transformers},
author = {Deligianni, Hariklia and Gallagher, William J. and Kitayaporn, Sathana and O'Sullivan, Eugene J. and Romankiw, Lubomyr T. and Wang, Naigang and Yoon, Joonah},
abstractNote = {A technique relates to a method of forming a laminated multilayer magnetic structure. An adhesion layer is deposited on a substrate. A magnetic seed layer is deposited on top of the adhesion layer. Magnetic layers and non-magnetic spacer layers are alternatingly deposited such that an even number of the magnetic layers is deposited while an odd number of the non-magnetic spacer layers is deposited. The odd number is one less than the even number. Every two of the magnetic layers is separated by one of the non-magnetic spacer layers. The first of the magnetic layers is deposited on the magnetic seed layer, and the magnetic layers each have a thickness less than 500 nanometers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {9}
}

Works referenced in this record:

RF Magnetic Properties of FeCoB/Al$_{2}$O$_{3}$/FeCoB Structure With Varied Al$_{2}$O$_{3}$ Thickness
journal, October 2011


Micromagnetics of laminated Permalloy films
journal, May 1988


Electrodeposition of NiP Film used as a Nonmagnetic Spacer in Laminated (CoFe/NiP)n Writer Pole
journal, August 2009