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Title: Solder hermetic sealing for OLEDs

Abstract

An OLED device comprising a substrate with a top surface; a first electrode covering the top surface of the substrate; a first insulating structure patterned over a portion of the first electrode where the pattern defines an inside area of the first electrode that is completely surrounded by the insulating structure, and an outside area of the first electrode not covered by the insulating structure; at least one organic layer for light emission within the inside area defined by the insulating structure; a second electrode over the at least one organic layer within the inside area defined by the insulating structure and at least partially over the first insulating structure; a cover slip located at least over the second electrode in the inside area defined by the insulating structure; and an electrically conductive solder seal making a hermetic seal between the insulating structure and the cover slip where the solder seal is in electrical contact with the second electrode. The insulating structure is desirably made of glass frit.

Inventors:
; ;
Issue Date:
Research Org.:
OLEDWorks, LLC, Rochester, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735191
Patent Number(s):
10756298
Application Number:
16/176,347
Assignee:
OLEDWorks LLC (Rochester, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
DOE Contract Number:  
SC0017100
Resource Type:
Patent
Resource Relation:
Patent File Date: 10/31/2018
Country of Publication:
United States
Language:
English

Citation Formats

Hamer, John W., Stickel, Scott, and Spencer, Timothy Floyd. Solder hermetic sealing for OLEDs. United States: N. p., 2020. Web.
Hamer, John W., Stickel, Scott, & Spencer, Timothy Floyd. Solder hermetic sealing for OLEDs. United States.
Hamer, John W., Stickel, Scott, and Spencer, Timothy Floyd. Tue . "Solder hermetic sealing for OLEDs". United States. https://www.osti.gov/servlets/purl/1735191.
@article{osti_1735191,
title = {Solder hermetic sealing for OLEDs},
author = {Hamer, John W. and Stickel, Scott and Spencer, Timothy Floyd},
abstractNote = {An OLED device comprising a substrate with a top surface; a first electrode covering the top surface of the substrate; a first insulating structure patterned over a portion of the first electrode where the pattern defines an inside area of the first electrode that is completely surrounded by the insulating structure, and an outside area of the first electrode not covered by the insulating structure; at least one organic layer for light emission within the inside area defined by the insulating structure; a second electrode over the at least one organic layer within the inside area defined by the insulating structure and at least partially over the first insulating structure; a cover slip located at least over the second electrode in the inside area defined by the insulating structure; and an electrically conductive solder seal making a hermetic seal between the insulating structure and the cover slip where the solder seal is in electrical contact with the second electrode. The insulating structure is desirably made of glass frit.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {8}
}

Works referenced in this record:

Sealed organic optoelectronic structures
patent, September 2003


Ceramic lid assembly for semiconductor packages
patent, October 1998


Hermetically sealed electronic device using solder bonding
patent, January 2017


Envelope for display device and method for manufacturing same
patent, January 1995


Method of forming encapsulation substrate for an organic light emitting diode display device
patent, August 2013