Solder hermetic sealing for OLEDs

Hamer, John W.; Stickel, Scott; Spencer, Timothy Floyd

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Title: Solder hermetic sealing for OLEDs

Abstract

An OLED device comprising a substrate with a top surface; a first electrode covering the top surface of the substrate; a first insulating structure patterned over a portion of the first electrode where the pattern defines an inside area of the first electrode that is completely surrounded by the insulating structure, and an outside area of the first electrode not covered by the insulating structure; at least one organic layer for light emission within the inside area defined by the insulating structure; a second electrode over the at least one organic layer within the inside area defined by the insulating structure and at least partially over the first insulating structure; a cover slip located at least over the second electrode in the inside area defined by the insulating structure; and an electrically conductive solder seal making a hermetic seal between the insulating structure and the cover slip where the solder seal is in electrical contact with the second electrode. The insulating structure is desirably made of glass frit.

Inventors:: Hamer, John W.; Stickel, Scott; Spencer, Timothy Floyd

Issue Date:: 2020-08-25

Research Org.:: OLEDWorks, LLC, Rochester, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1735191

Patent Number(s):: 10756298

Application Number:: 16/176,347

Assignee:: OLEDWorks LLC (Rochester, NY)

Patent Classifications (CPCs):: B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Show more

B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B23K1/0008 - {specially adapted for particular articles or work}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L24/26 - {Layer connectors, e.g. plate connectors, solder or adhesive layers
H01L24/81 - {using a bump connector}

Show less

DOE Contract Number:: SC0017100

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/31/2018

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Hamer, John W., Stickel, Scott, and Spencer, Timothy Floyd. Solder hermetic sealing for OLEDs.  United States: N. p., 2020. 
        Web.

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                    Hamer, John W., Stickel, Scott, & Spencer, Timothy Floyd. Solder hermetic sealing for OLEDs.  United States.

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                    Hamer, John W., Stickel, Scott, and Spencer, Timothy Floyd. Tue .  
        "Solder hermetic sealing for OLEDs".  United States.  https://www.osti.gov/servlets/purl/1735191.

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@article{osti_1735191,

  title        = {Solder hermetic sealing for OLEDs},

  author       = {Hamer, John W. and Stickel, Scott and Spencer, Timothy Floyd},

  abstractNote = {An OLED device comprising a substrate with a top surface; a first electrode covering the top surface of the substrate; a first insulating structure patterned over a portion of the first electrode where the pattern defines an inside area of the first electrode that is completely surrounded by the insulating structure, and an outside area of the first electrode not covered by the insulating structure; at least one organic layer for light emission within the inside area defined by the insulating structure; a second electrode over the at least one organic layer within the inside area defined by the insulating structure and at least partially over the first insulating structure; a cover slip located at least over the second electrode in the inside area defined by the insulating structure; and an electrically conductive solder seal making a hermetic seal between the insulating structure and the cover slip where the solder seal is in electrical contact with the second electrode. The insulating structure is desirably made of glass frit.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2020},

  month        = {8}

}

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Similar Records

Title: Solder hermetic sealing for OLEDs

Abstract

Citation Formats

Circuit Structure Including Semiconductive Chip Devices Joined to a Substrate by Solder Contacts patent, February 1970

Method of forming encapsulation substrate for an organic light emitting diode display device patent, August 2013

Display device and method of manufacturing the same patent-application, October 2008

Organic Electroluminescent Device patent-application, October 2013

Glass Seal Manufacture patent, October 1969

Monolithic integrated memory array structure including fabrication and package therefor patent, April 1970

High resolution display architecture patent-application, October 2013

Ceramic lid assembly for semiconductor packages patent, October 1998

Encapsulation of Polymer Based Solid State Devices with Inorganic Materials patent-application, October 2003

Method of Joining a Component to a Substrate patent, February 1969

Envelope for display device and method for manufacturing same patent, January 1995

Method of making a ternary barrier structure for conductive electrodes patent, April 1978

Display Apparatus patent-application, January 2014

Devices and Methods for Solder Flow Control in Three-dimensional Microstructures patent-application, February 2017

Hermetically sealed electronic device using solder bonding patent, January 2017

Organic Electroluminescent Device patent-application, November 2011

Sealed organic optoelectronic structures patent, September 2003

Organic Light Emitting Display Device patent-application, July 2007

Encapsulation of a Display Element and Method of Forming the Same patent-application, April 2003

Method for encapsulation of Electronic Devices patent-application, April 2003

Organic light emitting diode lighting apparatus patent-application, June 2011

Reducing Sheet Resistance for Common Electrode in Top Emission Organic Light Emitting Diode Display patent-application, September 2014

Method for Manufacturing Display Device patent-application, December 2015

Circuit Structure Including Semiconductive Chip Devices Joined to a Substrate by Solder Contacts
patent, February 1970

Method of forming encapsulation substrate for an organic light emitting diode display device
patent, August 2013

Display device and method of manufacturing the same
patent-application, October 2008

Organic Electroluminescent Device
patent-application, October 2013

Glass Seal Manufacture
patent, October 1969

Monolithic integrated memory array structure including fabrication and package therefor
patent, April 1970

High resolution display architecture
patent-application, October 2013

Ceramic lid assembly for semiconductor packages
patent, October 1998

Encapsulation of Polymer Based Solid State Devices with Inorganic Materials
patent-application, October 2003

Method of Joining a Component to a Substrate
patent, February 1969

Envelope for display device and method for manufacturing same
patent, January 1995

Method of making a ternary barrier structure for conductive electrodes
patent, April 1978

Display Apparatus
patent-application, January 2014

Devices and Methods for Solder Flow Control in Three-dimensional Microstructures
patent-application, February 2017

Hermetically sealed electronic device using solder bonding
patent, January 2017

Organic Electroluminescent Device
patent-application, November 2011

Sealed organic optoelectronic structures
patent, September 2003

Organic Light Emitting Display Device
patent-application, July 2007

Encapsulation of a Display Element and Method of Forming the Same
patent-application, April 2003

Method for encapsulation of Electronic Devices
patent-application, April 2003

Organic light emitting diode lighting apparatus
patent-application, June 2011

Reducing Sheet Resistance for Common Electrode in Top Emission Organic Light Emitting Diode Display
patent-application, September 2014

Method for Manufacturing Display Device
patent-application, December 2015