High-density, fail-in-place switches for computer and data networks
Abstract
A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1735174
- Patent Number(s):
- 10749817
- Application Number:
- 16/135,172
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- DOE Contract Number:
- B601996
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 09/19/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. High-density, fail-in-place switches for computer and data networks. United States: N. p., 2020.
Web.
Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. High-density, fail-in-place switches for computer and data networks. United States.
Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue .
"High-density, fail-in-place switches for computer and data networks". United States. https://www.osti.gov/servlets/purl/1735174.
@article{osti_1735174,
title = {High-density, fail-in-place switches for computer and data networks},
author = {Coteus, Paul W. and Doany, Fuad E. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},
abstractNote = {A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {8}
}
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