High-density, fail-in-place switches for computer and data networks

Coteus, Paul W.; Doany, Fuad E.; Hall, Shawn A.; Schultz, Mark D.; Takken, Todd E.; Tian, Shurong

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Title: High-density, fail-in-place switches for computer and data networks

Abstract

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Inventors:: Coteus, Paul W.; Doany, Fuad E.; Hall, Shawn A.; Schultz, Mark D.; Takken, Todd E.; Tian, Shurong

Issue Date:: 2020-08-18

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1735174

Patent Number(s):: 10749817

Application Number:: 16/135,172

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):: H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
H04L49/109 - {integrated on microchip, e.g. switch-on-chip}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K7/1444 - {Complex or three-dimensional-arrangements
H05K7/20254 - {Cold plates transferring heat from heat source to coolant}
H05K7/20309 - {Evaporators}
H05K7/20318 - {Condensers}
H05K7/20509 - {Cold plates, e.g. multi-component heat spreader, support plates, non closed structures}
H05K7/20572 - {within cabinets for removing heat from sub-racks, e.g. plenum}
H05K7/20763 - {Liquid cooling without phase change}

Show less

DOE Contract Number:: B601996

Resource Type:: Patent

Resource Relation:: Patent File Date: 09/19/2018

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING

Citation Formats


                    Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. High-density, fail-in-place switches for computer and data networks.  United States: N. p., 2020. 
        Web.

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                    Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. High-density, fail-in-place switches for computer and data networks.  United States.

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                    Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue .  
        "High-density, fail-in-place switches for computer and data networks".  United States.  https://www.osti.gov/servlets/purl/1735174.

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@article{osti_1735174,

  title        = {High-density, fail-in-place switches for computer and data networks},

  author       = {Coteus, Paul W. and Doany, Fuad E. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},

  abstractNote = {A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2020},

  month        = {8}

}

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