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Title: High-density, fail-in-place switches for computer and data networks

Abstract

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735174
Patent Number(s):
10749817
Application Number:
16/135,172
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
DOE Contract Number:  
B601996
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/19/2018
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. High-density, fail-in-place switches for computer and data networks. United States: N. p., 2020. Web.
Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., & Tian, Shurong. High-density, fail-in-place switches for computer and data networks. United States.
Coteus, Paul W., Doany, Fuad E., Hall, Shawn A., Schultz, Mark D., Takken, Todd E., and Tian, Shurong. Tue . "High-density, fail-in-place switches for computer and data networks". United States. https://www.osti.gov/servlets/purl/1735174.
@article{osti_1735174,
title = {High-density, fail-in-place switches for computer and data networks},
author = {Coteus, Paul W. and Doany, Fuad E. and Hall, Shawn A. and Schultz, Mark D. and Takken, Todd E. and Tian, Shurong},
abstractNote = {A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {8}
}

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