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Title: Reversibly bonded devices and methods of making and using the same

Abstract

The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.

Inventors:
;
Issue Date:
Research Org.:
Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735123
Patent Number(s):
10737261
Application Number:
15/719,187
Assignee:
Triad National Security, LLC (Los Alamos, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01L - CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
DOE Contract Number:  
AC52-06NA25396
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/28/2017
Country of Publication:
United States
Language:
English

Citation Formats

Nath, Pulak, and Huang, Jen-Huang. Reversibly bonded devices and methods of making and using the same. United States: N. p., 2020. Web.
Nath, Pulak, & Huang, Jen-Huang. Reversibly bonded devices and methods of making and using the same. United States.
Nath, Pulak, and Huang, Jen-Huang. Tue . "Reversibly bonded devices and methods of making and using the same". United States. https://www.osti.gov/servlets/purl/1735123.
@article{osti_1735123,
title = {Reversibly bonded devices and methods of making and using the same},
author = {Nath, Pulak and Huang, Jen-Huang},
abstractNote = {The present disclosure concerns embodiments of reversibly bonded devices that comprise a reversible bonding component. The reversible bonding component is able to exhibit strong adhesive properties so as to couple device components, but upon exposure to an energy source, the strong adhesive properties are weakened. By weakening the adhesive strength of the reversible bonding component, the device can be deconstructed to access internal biological samples for analysis and characterization.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {8}
}