Systems and methods for crack detection
Abstract
Embodiments related to systems and methods of crack detection in wafers (e.g., silicon wafers for photovoltaics, photovoltaic devices including silicon wafers) are disclosed. In some embodiments, an apparatus may include a light source configured to illuminate a side of a wafer and a camera directed towards a first face of the wafer. In some embodiments, a long axis of a field of view of the camera may be angled relative to a propagation direction of the light source. In some embodiments, at least a portion of the field of view of the camera is offset from the path of propagation of light emitted from the light source through the wafer. In some embodiments, at least a portion of a light beam may be oriented at a positive non-zero angle relative to the first face of the wafer, and a dimension of the light beam normal to the first face of the wafer may be larger than a thickness of the wafer.
- Inventors:
- Issue Date:
- Research Org.:
- Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1735076
- Patent Number(s):
- 10724965
- Application Number:
- 16/271,049
- Assignee:
- Massachusetts Institute of Technology (Cambridge, MA)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- EE0007535
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 02/08/2019
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 14 SOLAR ENERGY
Citation Formats
Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, and Liu, Zhe. Systems and methods for crack detection. United States: N. p., 2020.
Web.
Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, & Liu, Zhe. Systems and methods for crack detection. United States.
Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, and Liu, Zhe. Tue .
"Systems and methods for crack detection". United States. https://www.osti.gov/servlets/purl/1735076.
@article{osti_1735076,
title = {Systems and methods for crack detection},
author = {Sachs, Emanuel M. and Buonassisi, Tonio and Wieghold, Sarah and Liu, Zhe},
abstractNote = {Embodiments related to systems and methods of crack detection in wafers (e.g., silicon wafers for photovoltaics, photovoltaic devices including silicon wafers) are disclosed. In some embodiments, an apparatus may include a light source configured to illuminate a side of a wafer and a camera directed towards a first face of the wafer. In some embodiments, a long axis of a field of view of the camera may be angled relative to a propagation direction of the light source. In some embodiments, at least a portion of the field of view of the camera is offset from the path of propagation of light emitted from the light source through the wafer. In some embodiments, at least a portion of a light beam may be oriented at a positive non-zero angle relative to the first face of the wafer, and a dimension of the light beam normal to the first face of the wafer may be larger than a thickness of the wafer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jul 28 00:00:00 EDT 2020},
month = {Tue Jul 28 00:00:00 EDT 2020}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Method and device for detecting cracks in semiconductor substrates
patent, October 2015
- Ortner, Andreas; Gerstner, Klaus; Von Campe, Hilmar
- US Patent Document 9,157,869
Vicinal light inspection of translucent materials
patent, January 2010
- Burns, Geroge R.; Yang, Pin
- US Patent Document 7,650,028
Technique for determining defect positions in three dimensions in a transparent structure
patent, August 1998
- Henley, Francois J.; Bryan, Michael A.
- US Patent Document 5,790,247
System and Method for Detecting Cracks in a Wafer
patent-application, June 2014
- VanHoomissen, William; Wheeler, Sean
- US Patent Application 14/073535; 20140152976
Method and Apparatus for Inspecting Defects
patent-application, January 2010
- Ueno, Takeo; Nakano, Hiroyuki; Yoshitake, Yasuhiro
- US Patent Application 12/504972; 20100014083
Sample support with a non-reflecting sample supporting surface
patent, August 2000
- Heaton, John D.; Holmes, Duane C.
- US Patent Document 6,108,077
Apparatus, Method and Computer Program Product for Defect Detection in Work Pieces
patent-application, October 2016
- Marivoet, Tom; Truyens, Carl; Wouters, Christophe
- US Patent Application 15/200613; 20160313257
Inspection Method for Transparent Article
patent-application, September 2009
- Tanabe, Masaru
- US Patent Application 11/816617; 20090220864
Method and Device for the Detection of Defects in an Object
patent-application, March 2011
- Hemsendorf, Marc; Probst, Christian
- US Patent Application 12/874506; 20110058161
Apparatus for Detecting Micro-Cracks in Wafers and Method Therefor
patent-application, November 2011
- Chan, Sok Leng
- US Patent Application 12/681722; 20110268344
Method and device for the detection of defects in an object
patent, March 2013
- Hemsendorf, Marc; Probst, Christian
- US Patent Document 8,400,630
Apparatus and Method for Inspecting Internal Defect of Substrate
patent-application, February 2012
- Chou, Yen-Chun; Chen, Cheng-Kai; Chang, Jen-Ming
- US Patent Application 13/028692; 20120044346
Method and Device for Detecting Cracks in Semiconductor Substrates
patent-application, December 2012
- Ortner, Andreas; Gerstner, Klaus; Von Campe, Hilmar
- US Patent Application 13/504289; 20120307236
Apparatus for detecting micro-cracks in wafers and method therefor
patent, April 2013
- Chan, Sok Leng
- US Patent Document 8,428,337