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Title: Systems and methods for crack detection

Abstract

Embodiments related to systems and methods of crack detection in wafers (e.g., silicon wafers for photovoltaics, photovoltaic devices including silicon wafers) are disclosed. In some embodiments, an apparatus may include a light source configured to illuminate a side of a wafer and a camera directed towards a first face of the wafer. In some embodiments, a long axis of a field of view of the camera may be angled relative to a propagation direction of the light source. In some embodiments, at least a portion of the field of view of the camera is offset from the path of propagation of light emitted from the light source through the wafer. In some embodiments, at least a portion of a light beam may be oriented at a positive non-zero angle relative to the first face of the wafer, and a dimension of the light beam normal to the first face of the wafer may be larger than a thickness of the wafer.

Inventors:
; ; ;
Issue Date:
Research Org.:
Massachusetts Inst. of Technology (MIT), Cambridge, MA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735076
Patent Number(s):
10724965
Application Number:
16/271,049
Assignee:
Massachusetts Institute of Technology (Cambridge, MA)
Patent Classifications (CPCs):
G - PHYSICS G01 - MEASURING G01N - INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
EE0007535
Resource Type:
Patent
Resource Relation:
Patent File Date: 02/08/2019
Country of Publication:
United States
Language:
English

Citation Formats

Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, and Liu, Zhe. Systems and methods for crack detection. United States: N. p., 2020. Web.
Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, & Liu, Zhe. Systems and methods for crack detection. United States.
Sachs, Emanuel M., Buonassisi, Tonio, Wieghold, Sarah, and Liu, Zhe. Tue . "Systems and methods for crack detection". United States. https://www.osti.gov/servlets/purl/1735076.
@article{osti_1735076,
title = {Systems and methods for crack detection},
author = {Sachs, Emanuel M. and Buonassisi, Tonio and Wieghold, Sarah and Liu, Zhe},
abstractNote = {Embodiments related to systems and methods of crack detection in wafers (e.g., silicon wafers for photovoltaics, photovoltaic devices including silicon wafers) are disclosed. In some embodiments, an apparatus may include a light source configured to illuminate a side of a wafer and a camera directed towards a first face of the wafer. In some embodiments, a long axis of a field of view of the camera may be angled relative to a propagation direction of the light source. In some embodiments, at least a portion of the field of view of the camera is offset from the path of propagation of light emitted from the light source through the wafer. In some embodiments, at least a portion of a light beam may be oriented at a positive non-zero angle relative to the first face of the wafer, and a dimension of the light beam normal to the first face of the wafer may be larger than a thickness of the wafer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {7}
}

Works referenced in this record:

Sample support with a non-reflecting sample supporting surface
patent, August 2000


Vicinal light inspection of translucent materials
patent, January 2010


Method and device for the detection of defects in an object
patent, March 2013


Method and device for detecting cracks in semiconductor substrates
patent, October 2015