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Title: Low temperature cofired ceramic substrates and fabrication techniques for the same

Abstract

A low temperature cofired ceramic substrate comprises a plurality of dielectric layers, at least one inner conductor layer, a plurality of bond pads, and a solder mask. The dielectric layers are formed from ceramic material and placed one on top of another to form a stack. The inner conductor is formed from electrically conductive paste and positioned on an upper surface of at least one inner dielectric layer. The bond pads are positioned on an outer surface of the stack. Each bond pad is formed from a plurality of conductive sublayers of thin film metal stacked one on top of another, with each conductive sublayer being formed from a different metal. The solder mask is positioned on the same outer surface of the stack as the bond pads and includes a plurality of openings, with each opening exposing at least a portion of one of the bond pads.

Inventors:
;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735057
Patent Number(s):
10720338
Application Number:
15/805,352
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/07/2017
Country of Publication:
United States
Language:
English

Citation Formats

Young, Barbara, and Hamm, Randy. Low temperature cofired ceramic substrates and fabrication techniques for the same. United States: N. p., 2020. Web.
Young, Barbara, & Hamm, Randy. Low temperature cofired ceramic substrates and fabrication techniques for the same. United States.
Young, Barbara, and Hamm, Randy. Tue . "Low temperature cofired ceramic substrates and fabrication techniques for the same". United States. https://www.osti.gov/servlets/purl/1735057.
@article{osti_1735057,
title = {Low temperature cofired ceramic substrates and fabrication techniques for the same},
author = {Young, Barbara and Hamm, Randy},
abstractNote = {A low temperature cofired ceramic substrate comprises a plurality of dielectric layers, at least one inner conductor layer, a plurality of bond pads, and a solder mask. The dielectric layers are formed from ceramic material and placed one on top of another to form a stack. The inner conductor is formed from electrically conductive paste and positioned on an upper surface of at least one inner dielectric layer. The bond pads are positioned on an outer surface of the stack. Each bond pad is formed from a plurality of conductive sublayers of thin film metal stacked one on top of another, with each conductive sublayer being formed from a different metal. The solder mask is positioned on the same outer surface of the stack as the bond pads and includes a plurality of openings, with each opening exposing at least a portion of one of the bond pads.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {7}
}

Works referenced in this record:

Method of fabricating shaped springs
patent, November 2003


Infinitely stackable interconnect device and method
patent, March 2011


Microfabricated ion frequency standard
patent, December 2010


Fabrication methods and structures for micro-reservoir devices
patent, August 2008


Trilayered beam MEMS device and related methods
patent, July 2005