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Title: Provisioning cooling elements for chillerless data centers

Abstract

Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged.

Inventors:
;
Issue Date:
Research Org.:
International Business Machines Corp., Armonk, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1735034
Patent Number(s):
10716245
Application Number:
15/926,219
Assignee:
International Business Machines Corporation (Armonk, NY)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
DOE Contract Number:  
EE0002894
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/20/2018
Country of Publication:
United States
Language:
English

Citation Formats

Chainer, Timothy J., and Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States: N. p., 2020. Web.
Chainer, Timothy J., & Parida, Pritish R. Provisioning cooling elements for chillerless data centers. United States.
Chainer, Timothy J., and Parida, Pritish R. Tue . "Provisioning cooling elements for chillerless data centers". United States. https://www.osti.gov/servlets/purl/1735034.
@article{osti_1735034,
title = {Provisioning cooling elements for chillerless data centers},
author = {Chainer, Timothy J. and Parida, Pritish R.},
abstractNote = {Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {7}
}

Works referenced in this record:

Coolant and ambient temperature control for chillerless liquid cooled data centers
patent, February 2016


Smart cooling of data centers
patent, June 2003


Method and air-cooling unit with dynamic airflow and heat removal adjustability
patent, December 2009


Method and system for dynamically controlling cooling resources in a data center
patent, May 2008


System and method for facilitating cooling of a liquid-cooled electronics rack
patent, July 2010


Partition for varying the supply of cooling fluid
patent, March 2005