Heat dissipation assembly

Johnson, Matthew

Advanced Search OptionsAdvanced Search queries use a traditional Term Search. For more info, see our FAQ.

All Fields:

Patent Title:

Abstract:

Assignee:

Inventor(s):

Patent Number:

Patent Classification (CPC):

All Classifications
A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

More Options ...

Title: Heat dissipation assembly

Abstract

A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.

Inventors:: Johnson, Matthew

Issue Date:: 2020-04-14

Research Org.:: Kansas City Plant (KCP), Kansas City, MO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1650775

Patent Number(s):: 10622277

Application Number:: 16/006,227

Assignee:: Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

Show more

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L21/4882 - {Assembly of heatsink parts}
H01L2224/48095 - Kinked
H01L2224/73265 - Layer and wire connectors
H01L2224/85203 - Thermocompression bonding
H01L2224/85207 - Thermosonic bonding
H01L23/3677 - {Wire-like or pin-like cooling fins or heat sinks}
H01L23/3735 - {Laminates or multilayers, e.g. direct bond copper ceramic substrates}
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Show less

DOE Contract Number:: NA0000622

Resource Type:: Patent

Resource Relation:: Patent File Date: 06/12/2018

Country of Publication:: United States

Language:: English

Subject:: 36 MATERIALS SCIENCE; 42 ENGINEERING

Citation Formats


                    Johnson, Matthew. Heat dissipation assembly.  United States: N. p., 2020. 
        Web.

Copy to clipboard


                    Johnson, Matthew. Heat dissipation assembly.  United States.

Copy to clipboard


                    Johnson, Matthew. Tue .  
        "Heat dissipation assembly".  United States.  https://www.osti.gov/servlets/purl/1650775.

Copy to clipboard


                    
@article{osti_1650775,

  title        = {Heat dissipation assembly},

  author       = {Johnson, Matthew},

  abstractNote = {A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2020},

  month        = {4}

}

Copy to clipboard

Patent:

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
patent, January 1995

Polinski, Sr., Paul W.
US Patent Document 5,386,339
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5386339

Multi-Layer Circuit Substrate and Motor Drive Circuit Substrate
patent-application, October 2009

Nakai, Motoo; Nagase, Shigeki
US Patent Application 12/492429; 20090260858
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20090260858

Integrated Circuit Mounting for Thermal Stress Relief Useable in a Multi-Chip Module
patent-application, April 2007

Alhayek, Iyad; Bianco, Gerry
US Patent Application 11/234937; 20070090522
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070090522

Insulated Metal Substrate
patent-application, October 2014

Shashkov, Pavel; Khomutov, Gennady; Yerokhin, Aleksey
US Patent Application 13/984126; 20140293554
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20140293554

Copper Substrate with Feedthroughs and Interconnection Circuits
patent-application, February 2007

Salmon, Peter C.
US Patent Application 11/495009; 20070023889
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20070023889

Surface mountable hermetically sealed package
patent, May 2011

Zhuang, Weidong
US Patent Document 7,948,069
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7948069

Integrated Circuit Chip Packaging
patent-application, August 2017

Kwark, Young Hoon
US Patent Application 15/589131; 20170243816
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20170243816

Heat releasing member, package for accommodating semiconductor element and semiconductor device
patent, July 2005

Basho, Yoshihiro; Mori, Ryuji; Miyauchi, Masahiko
US Patent Document 6,921,971
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6921971

Semiconductor device having a heat-sink attached thereto
patent, May 1992

Katsuraoka, Kiyoshi
US Patent Document 5,117,281
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5117281

Ball grid array package with multiple interposers
patent, March 2005

Zhao, Sam Ziqun; Khan, Reza-ur Rahman
US Patent Document 6,861,750
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6861750

Low-Temperature-Cofired-Ceramic Package and Method of Manufacturing the Same
patent-application, April 2010

Kwank, Changsoo; Noh, Youn-Sub; Uhm, Man-Seok
US Patent Application 12/529775; 20100103623
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100103623

Semiconductor package with heat dissipating structure and method of manufacturing the same
patent, April 2007

Seo, Jeong-Woo
US Patent Document 7,202,561
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7202561

Similar Records in DOE Patents and OSTI.GOV collections:

System for dissipating fuel egress in fuel supply conduit assemblies

Patent Hughes, Michael John; Natarajan, Jayaprakash

A system for dissipating fuel egress includes a fuel injector and a fuel supply assembly. The fuel supply assembly has a fuel supply line that provides fuel and a purge air conduit arranged co-axially around the fuel supply line, thereby defining an annular channel around the fuel supply line. The fuel injector includes a perimeter body, a fuel injection port associated with the perimeter body, and an internal mixing chamber downstream of the fuel injection port in a direction of fuel flow. The fuel supply line provides fuel to the fuel injection port. The perimeter body of the fuel injectormore » « less
Full Text Available
Heating assemblies, heat exchange assemblies, methods for providing and/or exchanging heat, turbine combustion engines, and methods for powering turbine combustion engines

Patent McGrail, B. Peter; Jenks, Jeromy J.; Bernacki, Bruce E.

Heat exchanger assemblies and methods for providing heat exchange as well as methods providing specific energy to predetermined materials within an assembly as well as gas turbine engines as well as methods of powering same are provided. Heating assemblies are provided that can include: a heat-sinking substrate; and a selective emitter layer in thermal communication with the substrate. These assemblies can be provided as part of heat exchanger assemblies. Methods for providing heat to a fluid are also provided that can include heating a layer upon a substrate to provide photons of a predetermined wavelength to a fluid from themore » « less
Full Text Available
LED lamp incorporating remote phosphor with heat dissipation features

Patent Tong, Tao; Letoquin, Ronan; Keller, Bernd; ...

An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote planar phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED lightmore » « less
Full Text Available
Graphene heat dissipating structure

Patent Washburn, Cody M.; Lambert, Timothy N.; Wheeler, David R.; ...

Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium moleculemore » « less
Full Text Available
Firearm suppressor having enhanced thermal management for rapid heat dissipation

Patent Moss, William C.; Anderson, Andrew T.

A suppressor is disclosed for use with a weapon having a barrel through which a bullet is fired. The suppressor has an inner portion having a bore extending coaxially therethrough. The inner portion is adapted to be secured to a distal end of the barrel. A plurality of axial flow segments project radially from the inner portion and form axial flow paths through which expanding propellant gasses discharged from the barrel flow through. The axial flow segments have radially extending wall portions that define sections which may be filled with thermally conductive material, which in one example is a thermallymore » « less
Full Text Available

Similar Records

Title: Heat dissipation assembly

Abstract

Citation Formats

Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink patent, January 1995

Multi-Layer Circuit Substrate and Motor Drive Circuit Substrate patent-application, October 2009

Integrated Circuit Mounting for Thermal Stress Relief Useable in a Multi-Chip Module patent-application, April 2007

Insulated Metal Substrate patent-application, October 2014

Copper Substrate with Feedthroughs and Interconnection Circuits patent-application, February 2007

Surface mountable hermetically sealed package patent, May 2011

Integrated Circuit Chip Packaging patent-application, August 2017

Heat releasing member, package for accommodating semiconductor element and semiconductor device patent, July 2005

Semiconductor device having a heat-sink attached thereto patent, May 1992

Ball grid array package with multiple interposers patent, March 2005

Low-Temperature-Cofired-Ceramic Package and Method of Manufacturing the Same patent-application, April 2010

Semiconductor package with heat dissipating structure and method of manufacturing the same patent, April 2007

Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
patent, January 1995

Multi-Layer Circuit Substrate and Motor Drive Circuit Substrate
patent-application, October 2009

Integrated Circuit Mounting for Thermal Stress Relief Useable in a Multi-Chip Module
patent-application, April 2007

Insulated Metal Substrate
patent-application, October 2014

Copper Substrate with Feedthroughs and Interconnection Circuits
patent-application, February 2007

Surface mountable hermetically sealed package
patent, May 2011

Integrated Circuit Chip Packaging
patent-application, August 2017

Heat releasing member, package for accommodating semiconductor element and semiconductor device
patent, July 2005

Semiconductor device having a heat-sink attached thereto
patent, May 1992

Ball grid array package with multiple interposers
patent, March 2005

Low-Temperature-Cofired-Ceramic Package and Method of Manufacturing the Same
patent-application, April 2010

Semiconductor package with heat dissipating structure and method of manufacturing the same
patent, April 2007