Porous thermally insulating compositions containing hollow silica particles
Abstract
A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m·K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R1R2R3R4N+A−, with at least one of R1, R2, R3, and R4 being an alkyl group containing at least ten carbon atoms (and A− is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.
- Inventors:
- Issue Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1650735
- Patent Number(s):
- 10611902
- Application Number:
- 15/889,543
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C01 - INORGANIC CHEMISTRY C01B - NON-METALLIC ELEMENTS
C - CHEMISTRY C01 - INORGANIC CHEMISTRY C01P - INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- DOE Contract Number:
- AC05-00OR22725
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 02/06/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY; 36 MATERIALS SCIENCE
Citation Formats
Sharma, Jaswinder K. Porous thermally insulating compositions containing hollow silica particles. United States: N. p., 2020.
Web.
Sharma, Jaswinder K. Porous thermally insulating compositions containing hollow silica particles. United States.
Sharma, Jaswinder K. Tue .
"Porous thermally insulating compositions containing hollow silica particles". United States. https://www.osti.gov/servlets/purl/1650735.
@article{osti_1650735,
title = {Porous thermally insulating compositions containing hollow silica particles},
author = {Sharma, Jaswinder K.},
abstractNote = {A thermally insulating composition comprising hollow spherical silica particles and a coating of a material having a thermal conductivity of less than 0.3 W/m·K on surfaces of said silica particles. In particular embodiments, the low conductivity coating material may be a polymer, such as polystyrene or polyvinylpyrrolidone, or the low conductivity coating material may be a quaternary ammonium salt of the Formula (1), i.e., R1R2R3R4N+A−, with at least one of R1, R2, R3, and R4 being an alkyl group containing at least ten carbon atoms (and A− is a counter anion), or the low conductivity coating material may be phenyl-C61-butyric acid methyl ester covalently bound to the hollow spherical silica particles. Also described herein is a method of thermally insulating a surface by applying a coating of the thermally insulating composition, described above, onto the surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Apr 07 00:00:00 EDT 2020},
month = {Tue Apr 07 00:00:00 EDT 2020}
}
Works referenced in this record:
Hollow-Structured Mesoporous Silica Material and Preparation Process
patent-application, November 2005
- Chen, Jianfeng; Liu, Runjing; Jimmy, Yun
- US Patent Application 11/171152; 20050244322
Hollow Silica Particle with a Polymer Thereon
patent-application, February 2012
- Liu, Ye; Wu, Decheng
- US Patent Application 13/148046; 20120045515