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Title: Preparation of asymmetric porous materials

Abstract

As asymmetric porous film structure formed by depositing a porous material film on a flexible substrate, and applying an anisotropic stress to the porous media on the flexible substrate, where the anisotropic stress results from a stress such as an applied mechanical force, a thermal gradient, and an applied voltage, to form an asymmetric porous material.

Inventors:
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1650729
Patent Number(s):
10610822
Application Number:
14/667,749
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL B01D - SEPARATION
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/25/2015
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE

Citation Formats

Coker, Eric N. Preparation of asymmetric porous materials. United States: N. p., 2020. Web.
Coker, Eric N. Preparation of asymmetric porous materials. United States.
Coker, Eric N. Tue . "Preparation of asymmetric porous materials". United States. https://www.osti.gov/servlets/purl/1650729.
@article{osti_1650729,
title = {Preparation of asymmetric porous materials},
author = {Coker, Eric N.},
abstractNote = {As asymmetric porous film structure formed by depositing a porous material film on a flexible substrate, and applying an anisotropic stress to the porous media on the flexible substrate, where the anisotropic stress results from a stress such as an applied mechanical force, a thermal gradient, and an applied voltage, to form an asymmetric porous material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {4}
}

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Three Dimensionally Periodic Structural Assemblies on Nanometer and Longer Scales
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Recycling bird feeder
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High-Dielectric Constant Thin Film Metal Oxides on Silicon Wafers for Capacitor Applications and Methods of Manufacture
patent-application, September 2008