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Title: Group-III nitride devices and systems on IBAD-textured substrates

Abstract

A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used. The user is able to choose a substrate for its mechanical and thermal properties, such as how well its coefficient of thermal expansion matches that of the hexagonal epitaxial layer, while choosing a textured layer that more closely lattice matches that layer. Electronic devices such as LEDs can be manufactured from such structures. Because the substrate can act as both a reflector and a heat sink, transfer to other substrates, and use ofmore » external reflectors and heat sinks, is not required, greatly reducing costs. Large area devices such as light emitting strips or sheets may be fabricated using this technology.« less

Inventors:
;
Issue Date:
Research Org.:
iBeam Materials, Inc., Santa Fe, NM (United States)
Sponsoring Org.:
USDOE Advanced Research Projects Agency - Energy (ARPA-E)
OSTI Identifier:
1632500
Patent Number(s):
10546976
Application Number:
16/365,521
Assignee:
iBeam Materials, Inc. (Santa Fe, NM)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AR0000447
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/26/2019
Country of Publication:
United States
Language:
English

Citation Formats

Matias, Vladimir, and Yung, Christopher. Group-III nitride devices and systems on IBAD-textured substrates. United States: N. p., 2020. Web.
Matias, Vladimir, & Yung, Christopher. Group-III nitride devices and systems on IBAD-textured substrates. United States.
Matias, Vladimir, and Yung, Christopher. Tue . "Group-III nitride devices and systems on IBAD-textured substrates". United States. https://www.osti.gov/servlets/purl/1632500.
@article{osti_1632500,
title = {Group-III nitride devices and systems on IBAD-textured substrates},
author = {Matias, Vladimir and Yung, Christopher},
abstractNote = {A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used. The user is able to choose a substrate for its mechanical and thermal properties, such as how well its coefficient of thermal expansion matches that of the hexagonal epitaxial layer, while choosing a textured layer that more closely lattice matches that layer. Electronic devices such as LEDs can be manufactured from such structures. Because the substrate can act as both a reflector and a heat sink, transfer to other substrates, and use of external reflectors and heat sinks, is not required, greatly reducing costs. Large area devices such as light emitting strips or sheets may be fabricated using this technology.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {1}
}

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Works referenced in this record:

Compact, flexible, LED array
patent, April 2002


Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices
patent, July 2013


Electroplating of superconductor elements
patent, November 1995


Epitaxial hexagonal materials on IBAD-textured substrates
patent, August 2017