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Title: Circuit board interconnect decals

Abstract

A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.

Inventors:
;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1632422
Patent Number(s):
10531568
Application Number:
16/253,362
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
Patent Classifications (CPCs):
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
C - CHEMISTRY C09 - DYES C09J - ADHESIVES
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/22/2019
Country of Publication:
United States
Language:
English

Citation Formats

Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Circuit board interconnect decals. United States: N. p., 2020. Web.
Hatch, Stephen McGarry, & Hatch, Jonathan Douglas. Circuit board interconnect decals. United States.
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Tue . "Circuit board interconnect decals". United States. https://www.osti.gov/servlets/purl/1632422.
@article{osti_1632422,
title = {Circuit board interconnect decals},
author = {Hatch, Stephen McGarry and Hatch, Jonathan Douglas},
abstractNote = {A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2020},
month = {1}
}

Patent:

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Works referenced in this record:

Method of transferring an inorganic image
patent, May 1991


Method for molding a multilayered trim component
patent, October 1997


Semiconductor package including flex circuit, interconnects and dense array external contacts
patent, October 2002