Electroless deposition of metal on 3D-printed polymeric structures
Abstract
A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 1600352
- Patent Number(s):
- 10494721
- Application Number:
- 15/671,345
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
C - CHEMISTRY C23 - COATING METALLIC MATERIAL C23C - COATING METALLIC MATERIAL
- DOE Contract Number:
- NA0003525
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 08/08/2017
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Citation Formats
Robinson, David, and Jones, Christopher G. Electroless deposition of metal on 3D-printed polymeric structures. United States: N. p., 2019.
Web.
Robinson, David, & Jones, Christopher G. Electroless deposition of metal on 3D-printed polymeric structures. United States.
Robinson, David, and Jones, Christopher G. Tue .
"Electroless deposition of metal on 3D-printed polymeric structures". United States. https://www.osti.gov/servlets/purl/1600352.
@article{osti_1600352,
title = {Electroless deposition of metal on 3D-printed polymeric structures},
author = {Robinson, David and Jones, Christopher G.},
abstractNote = {A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {12}
}
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Works referenced in this record:
Seed layer deposition
patent, November 2004
- Shelnut, James G.; Merricks, David; Dutkewych, Oleh B.
- US Patent Document 6,824,665
Electroless plating of a metal layer on an activated substrate
patent, July 1999
- Fry, James L.; Uhlenbrock, Stefan; Klein, Rita J.
- US Patent Document 5,925,415