Self-alignment features for III-V ridge process and angled facet die

Title: Self-alignment features for III-V ridge process and angled facet die

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Abstract

A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.

Inventors:: Barwicz, Tymon; Martin, Yves C.; Orcutt, Jason S.

Issue Date:: 2019-11-26

Research Org.:: International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600339

Patent Number(s):: 10490971

Application Number:: 15/618,958

Assignee:: International Business Machines Corporation (Armonk, NY)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01S - DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT
H01S5/02252 - {Relative positioning of laser diode and optical components, e.g. grooves in the mount to fix an optical fibre or a lens}
H01S5/04252 - {characterised by the material}
H01S5/02276 - {Wire-bonding details}
H01S5/02268 - {Positioning, e.g. using marks for positioning of the laser diode}
H01S2301/176 - Specific passivation layers on surfaces other than the emission facet
H01S5/0224 - {Up-side down mounting, e.g. flip-chip or epi-side down mounted laser}
H01S5/22 - having a ridge or stripe structure
H01S5/02272 - {using soldering}

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DOE Contract Number:: AR0000540

Resource Type:: Patent

Resource Relation:: Patent File Date: 06/09/2017

Country of Publication:: United States

Language:: English

Subject:: 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 42 ENGINEERING

Citation Formats


                    Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die.  United States: N. p., 2019. 
        Web.

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                    Barwicz, Tymon, Martin, Yves C., & Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die.  United States.

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                    Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Tue .  
        "Self-alignment features for III-V ridge process and angled facet die".  United States.  https://www.osti.gov/servlets/purl/1600339.

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@article{osti_1600339,

  title        = {Self-alignment features for III-V ridge process and angled facet die},

  author       = {Barwicz, Tymon and Martin, Yves C. and Orcutt, Jason S.},

  abstractNote = {A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {11}

}

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