Self-alignment features for III-V ridge process and angled facet die
Abstract
A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600339
- Patent Number(s):
- 10,490,971
- Application Number:
- 15/618,958
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- DOE Contract Number:
- AR0000540
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/09/2017
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; 42 ENGINEERING
Citation Formats
Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States: N. p., 2019.
Web.
Barwicz, Tymon, Martin, Yves C., & Orcutt, Jason S. Self-alignment features for III-V ridge process and angled facet die. United States.
Barwicz, Tymon, Martin, Yves C., and Orcutt, Jason S. Tue .
"Self-alignment features for III-V ridge process and angled facet die". United States. https://www.osti.gov/servlets/purl/1600339.
@article{osti_1600339,
title = {Self-alignment features for III-V ridge process and angled facet die},
author = {Barwicz, Tymon and Martin, Yves C. and Orcutt, Jason S.},
abstractNote = {A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}
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Works referenced in this record:
Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features
patent, August 2006
- O'Gorman, James Christopher
- US Patent Document 7,083,994
Surface emitting and receiving photonic device with lens
patent, July 2007
- Behfar, Alex A.; Schremer, Jr., Alfred T.; Stagarescu, Cristian B.
- US Patent Document 7,245,645
Process for forming the ridge structure of a self-aligned semiconductor laser
patent, October 1991
- Harder, Christoph S.; Heuberger, Wilhelm; Hoh, Peter D.
- US Patent Document 5,059,552
High reliability etched-facet photonic devices
patent, July 2014
- Behfar, Alex A.
- US Patent Document 8,787,419
Photonic chip mounting in a recess for waveguide alignment and connection
patent, May 2005
- Zhou, Yan; Ho, Seng-Tiong
- US Patent Document 6,888,989
Assembly of electronic and optical devices
patent, June 2016
- Barwicz, Tymon; Dang, Bing
- US Patent Document 9,364,925
Self-aligned optical waveguide to laser structure and method for making the same
patent, November 1993
- Bona, Gian-Luca Luca; Gfeller, Fritz R.; Jaeckel, Heinz
- US Patent Document 5,259,049
Alignment apparatus and method for aligning stacked devices
patent, November 2007
- Steinberg, Dan A.; Dautartas, Mindaugas; Rasnake, Jasean
- US Patent Document 7,290,321