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Title: Hybrid chip-on-board LED module with patterned encapsulation

Abstract

Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.

Inventors:
; ;
Issue Date:
Research Org.:
Lumileds LLC, San Jose, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600332
Patent Number(s):
10490710
Application Number:
15/887,603
Assignee:
Lumileds LLC (San Jose, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
DOE Contract Number:  
EE0005099
Resource Type:
Patent
Resource Relation:
Patent File Date: 02/02/2018
Country of Publication:
United States
Language:
English

Citation Formats

Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States: N. p., 2019. Web.
Soer, Wouter Anthon, Helbing, Rene, & Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation. United States.
Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Tue . "Hybrid chip-on-board LED module with patterned encapsulation". United States. https://www.osti.gov/servlets/purl/1600332.
@article{osti_1600332,
title = {Hybrid chip-on-board LED module with patterned encapsulation},
author = {Soer, Wouter Anthon and Helbing, Rene and Huang, Guan},
abstractNote = {Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}

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Works referenced in this record:

Light-Emitting Device
patent-application, October 2013


Lamp module
patent, December 2014


Variable optics spot module
patent, August 2004