Hybrid chip-on-board LED module with patterned encapsulation

Soer, Wouter Anthon; Helbing, Rene; Huang, Guan

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Title: Hybrid chip-on-board LED module with patterned encapsulation

Abstract

Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.

Inventors:: Soer, Wouter Anthon; Helbing, Rene; Huang, Guan

Issue Date:: 2019-11-26

Research Org.:: Lumileds LLC, San Jose, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1600332

Patent Number(s):: 10490710

Application Number:: 15/887,603

Assignee:: Lumileds LLC (San Jose, CA)

Patent Classifications (CPCs):: H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING

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H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
H01L25/0753 - {the devices being arranged next to each other}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L2933/0041 - relating to wavelength conversion elements
H01L2933/005 - relating to encapsulations
H01L2933/0091 - Scattering means in or on the semiconductor body or semiconductor body package
H01L33/50 - Wavelength conversion elements
H01L33/502 - {Wavelength conversion materials}
H01L33/508 - {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material}
H01L33/52 - Encapsulations
H01L33/54 - having a particular shape

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05B - ELECTRIC HEATING
H05B45/10 - Controlling the intensity of the light
H05B47/10 - Controlling the light source

Show less

DOE Contract Number:: EE0005099

Resource Type:: Patent

Resource Relation:: Patent File Date: 02/02/2018

Country of Publication:: United States

Language:: English

Citation Formats


                    Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation.  United States: N. p., 2019. 
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                    Soer, Wouter Anthon, Helbing, Rene, & Huang, Guan. Hybrid chip-on-board LED module with patterned encapsulation.  United States.

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                    Soer, Wouter Anthon, Helbing, Rene, and Huang, Guan. Tue .  
        "Hybrid chip-on-board LED module with patterned encapsulation".  United States.  https://www.osti.gov/servlets/purl/1600332.

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@article{osti_1600332,

  title        = {Hybrid chip-on-board LED module with patterned encapsulation},

  author       = {Soer, Wouter Anthon and Helbing, Rene and Huang, Guan},

  abstractNote = {Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {11}

}

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Title: Hybrid chip-on-board LED module with patterned encapsulation

Abstract

Citation Formats

Light-Emitting Device patent-application, October 2013

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Laminating encapsulant film containing phosphor over LEDs patent, March 2008

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Variable optics spot module patent, August 2004

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Light-Emitting Device Array With Individual Cells patent-application, December 2010

Light-Emitting Device
patent-application, October 2013

Drive circuit for a color temperature tunable LED light source
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Chip Scale Light Emitting Device Package With Dome
patent-application, April 2016

Light device and its light emitting diode module
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patent, April 2015

Lighting Device Having Groups of Solid State Light Emitters, and Lighting Arrangement
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