skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Nanomaterial assisted bonding method to produce curved surfaces

Abstract

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

Inventors:
;
Issue Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600318
Patent Number(s):
10,486,405
Application Number:
15/872,011
Assignee:
U.S. Department of Energy (Washington, DC)
DOE Contract Number:  
AC02-06CH11357
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/16/2018
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY

Citation Formats

Suthar, Kamleshkumar, and White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States: N. p., 2019. Web.
Suthar, Kamleshkumar, & White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States.
Suthar, Kamleshkumar, and White, Marion M. Tue . "Nanomaterial assisted bonding method to produce curved surfaces". United States. https://www.osti.gov/servlets/purl/1600318.
@article{osti_1600318,
title = {Nanomaterial assisted bonding method to produce curved surfaces},
author = {Suthar, Kamleshkumar and White, Marion M.},
abstractNote = {A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}

Patent:

Save / Share: