Nanomaterial assisted bonding method to produce curved surfaces
Abstract
A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600318
- Patent Number(s):
- 10486405
- Application Number:
- 15/872,011
- Assignee:
- U.S. Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
C - CHEMISTRY C04 - CEMENTS C04B - LIME, MAGNESIA
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 01/16/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Suthar, Kamleshkumar, and White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States: N. p., 2019.
Web.
Suthar, Kamleshkumar, & White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States.
Suthar, Kamleshkumar, and White, Marion M. Tue .
"Nanomaterial assisted bonding method to produce curved surfaces". United States. https://www.osti.gov/servlets/purl/1600318.
@article{osti_1600318,
title = {Nanomaterial assisted bonding method to produce curved surfaces},
author = {Suthar, Kamleshkumar and White, Marion M.},
abstractNote = {A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}
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