Nanomaterial assisted bonding method to produce curved surfaces
Abstract
A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Laboratory (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600318
- Patent Number(s):
- 10486405
- Application Number:
- 15/872,011
- Assignee:
- U.S. Department of Energy (Washington, DC)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29C - SHAPING OR JOINING OF PLASTICS
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 01/16/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Suthar, Kamleshkumar, and White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States: N. p., 2019.
Web.
Suthar, Kamleshkumar, & White, Marion M. Nanomaterial assisted bonding method to produce curved surfaces. United States.
Suthar, Kamleshkumar, and White, Marion M. Tue .
"Nanomaterial assisted bonding method to produce curved surfaces". United States. https://www.osti.gov/servlets/purl/1600318.
@article{osti_1600318,
title = {Nanomaterial assisted bonding method to produce curved surfaces},
author = {Suthar, Kamleshkumar and White, Marion M.},
abstractNote = {A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}
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