Thickness mapping using multispectral imaging
Abstract
An example system includes a material transport system configured to transport a substantially planar material through a monitoring zone, an illumination source configured to illuminate at least a portion of the material that is within the monitoring zone with light, and a sensor configured to obtain a plurality of consecutive datasets. Datasets indicate, for locations of the material and for a specific wavelength of light, a respective intensity of the light that is of the wavelength and that is received from the location. The system also includes a processing system configured to receive the dataset, determine, based on the dataset and for each of at least two locations in the plurality of locations, a respective value of a thickness of the material, and execute, based on the respective value of the thickness of the material for at least one of the at least two locations, an action.
- Inventors:
- Issue Date:
- Research Org.:
- National Renewable Energy Laboratory (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600300
- Patent Number(s):
- 10480935
- Application Number:
- 15/830,585
- Assignee:
- Alliance for Sustainable Energy, LLC (Golden, CO)
- Patent Classifications (CPCs):
-
G - PHYSICS G01 - MEASURING G01B - MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS
- DOE Contract Number:
- AC36-08GO28308
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 12/04/2017
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION; 42 ENGINEERING
Citation Formats
Rupnowski, Przemyslaw, and Ulsh, Michael Joseph. Thickness mapping using multispectral imaging. United States: N. p., 2019.
Web.
Rupnowski, Przemyslaw, & Ulsh, Michael Joseph. Thickness mapping using multispectral imaging. United States.
Rupnowski, Przemyslaw, and Ulsh, Michael Joseph. Tue .
"Thickness mapping using multispectral imaging". United States. https://www.osti.gov/servlets/purl/1600300.
@article{osti_1600300,
title = {Thickness mapping using multispectral imaging},
author = {Rupnowski, Przemyslaw and Ulsh, Michael Joseph},
abstractNote = {An example system includes a material transport system configured to transport a substantially planar material through a monitoring zone, an illumination source configured to illuminate at least a portion of the material that is within the monitoring zone with light, and a sensor configured to obtain a plurality of consecutive datasets. Datasets indicate, for locations of the material and for a specific wavelength of light, a respective intensity of the light that is of the wavelength and that is received from the location. The system also includes a processing system configured to receive the dataset, determine, based on the dataset and for each of at least two locations in the plurality of locations, a respective value of a thickness of the material, and execute, based on the respective value of the thickness of the material for at least one of the at least two locations, an action.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {11}
}
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