Microscale sensors for direct metrology of additively manufactured features
Abstract
This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1600201
- Patent Number(s):
- 10451539
- Application Number:
- 15/910,604
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA); Board of Regents, The University of Texas System (Austin, TX)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B33 - ADDITIVE MANUFACTURING TECHNOLOGY B33Y - ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81C - PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 03/02/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE
Citation Formats
Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., and Ladner, Ian Seth. Microscale sensors for direct metrology of additively manufactured features. United States: N. p., 2019.
Web.
Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., & Ladner, Ian Seth. Microscale sensors for direct metrology of additively manufactured features. United States.
Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., and Ladner, Ian Seth. Tue .
"Microscale sensors for direct metrology of additively manufactured features". United States. https://www.osti.gov/servlets/purl/1600201.
@article{osti_1600201,
title = {Microscale sensors for direct metrology of additively manufactured features},
author = {Saha, Sourabh and Panas, Robert Matthew and Cullinan, Michael A. and Ladner, Ian Seth},
abstractNote = {This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}
Works referenced in this record:
MEMS micro-translation device with improved linear travel capability
patent, September 2007
- Abushagur, Mustafa A. G.; Ferguson, Cynthia K.; Nordin, Gregory
- US Patent Document 7,265,476
Push-to-pull tensile testing of ultra-strong nanoscale ceramic–polymer composites made by additive manufacturing
journal, June 2015
- Bauer, Jens; Schroer, Almut; Schwaiger, Ruth
- Extreme Mechanics Letters, Vol. 3
Dynamic Actuation of Soft 3D Micromechanical Structures Using Micro-Electromechanical Systems (MEMS)
journal, January 2018
- Jayne, Rachael K.; Stark, Thomas J.; Reeves, Jeremy B.
- Advanced Materials Technologies, Vol. 3, Issue 3
A thermal actuator for nanoscale in situ microscopy testing: design and characterization
journal, January 2006
- Zhu, Yong; Corigliano, Alberto; Espinosa, Horacio D.
- Journal of Micromechanics and Microengineering, Vol. 16, Issue 2
A microelectromechanical load sensor for in situ electron and x-ray microscopy tensile testing of nanostructures
journal, December 2004
- Zhu, Yong; Moldovan, N.; Espinosa, Horacio D.
- Applied Physics Letters, Vol. 86, Issue 1
Environmentally compensated capacitive sensor
patent, July 2016
- Deeds, Michael; Kaminski, Gregory
- US Patent Document 9,390,061
Design and Operation of a MEMS-Based Material Testing System for Nanomechanical Characterization
journal, October 2007
- Espinosa, H. D.; Moldovan, N.
- Journal of Microelectromechanical Systems, Vol. 16, Issue 5
Microelectromechanical device and system
patent, March 2016
- Espinosa, Horacio D.; Montoya, Rodrigo A. Bernal
- US Patent Document 9,279,753
Micromechanical positional state sensing apparatus method and system
patent, November 2009
- Messenger, Robert; McLain, Timothy; Anderson, Jeffrey K.
- US Patent Document 7,616,013
Controlling Young’s modulus of polymerized structures fabricated by direct laser writing
journal, September 2014
- Zhang, Shi-Jie; Li, Yan; Wang, Yang-Kai
- Applied Physics A, Vol. 118, Issue 2
Young’s modulus measurement of two-photon polymerized micro-cantilevers by using nanoindentation equipment
journal, November 2012
- Cicha, Klaus; Koch, Thomas; Torgersen, Jan
- Journal of Applied Physics, Vol. 112, Issue 9
Method and apparatus for a micromachined multisensor
patent, July 2011
- Geen, John A.; Kuang, Jinbo; Kumar, Vineet
- US Patent Document 7,980,133
Systems and methods for improved control of micro-electrical-mechanical system (MEMS) electrostatic actuator
patent, June 2009
- Borovic, Bruno; Lewis, Frank L.; Liu, Ai Qun
- US Patent Document 7,548,011
Stiction in surface micromachining
journal, December 1996
- Tas, Niels; Sonnenberg, Tonny; Jansen, Henri
- Journal of Micromechanics and Microengineering, Vol. 6, Issue 4
Quantitative in situ TEM tensile fatigue testing on nanocrystalline metallic ultrathin films
journal, January 2013
- Hosseinian, Ehsan; Pierron, Olivier N.
- Nanoscale, Vol. 5, Issue 24
MEMS for In Situ Testing—Handling, Actuation, Loading, and Displacement Measurements
journal, May 2010
- Haque, M. A.; Espinosa, H. D.; Lee, H. J.
- MRS Bulletin, Vol. 35, Issue 5
An electromechanical material testing system for in situ electron microscopy and applications
journal, September 2005
- Zhu, Y.; Espinosa, H. D.
- Proceedings of the National Academy of Sciences, Vol. 102, Issue 41, p. 14503-14508