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Title: Microscale sensors for direct metrology of additively manufactured features

Abstract

This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.

Inventors:
; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1600201
Patent Number(s):
10,451,539
Application Number:
15/910,604
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA); Board of Regents, The University of Texas System (Austin, TX)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/02/2018
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., and Ladner, Ian Seth. Microscale sensors for direct metrology of additively manufactured features. United States: N. p., 2019. Web.
Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., & Ladner, Ian Seth. Microscale sensors for direct metrology of additively manufactured features. United States.
Saha, Sourabh, Panas, Robert Matthew, Cullinan, Michael A., and Ladner, Ian Seth. Tue . "Microscale sensors for direct metrology of additively manufactured features". United States. https://www.osti.gov/servlets/purl/1600201.
@article{osti_1600201,
title = {Microscale sensors for direct metrology of additively manufactured features},
author = {Saha, Sourabh and Panas, Robert Matthew and Cullinan, Michael A. and Ladner, Ian Seth},
abstractNote = {This invention relates to a microelectromechanical device for mechanical characterization of a specimen. In one embodiment the device may incorporate a substrate, at least one first flexure bearing and at least one second flexure bearing, both being supported on the substrate. First and second movable shuttles may be used which are supported above the substrate by the flexure bearings so that each is free to move linearly relative to the substrate. Ends of the movable shuttles are separated by a gap. A thermal actuator may be connected to one end of the first movable shuttle, and operates to cause the first movable shuttle to move in a direction parallel to the surface of the substrate in response to a signal applied to the thermal actuator. A first capacitive sensor may be formed between the first movable shuttle and the substrate, and a second capacitive sensor formed between the second movable shuttle and the substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}

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Works referenced in this record:

Method and apparatus for a micromachined multisensor
patent, July 2011


Environmentally compensated capacitive sensor
patent, July 2016


Micromechanical positional state sensing apparatus method and system
patent, November 2009


Microelectromechanical device and system
patent, March 2016


MEMS micro-translation device with improved linear travel capability
patent, September 2007