Method of thin film adhesion pretreatment

Girardi, Michael

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
E - fixed constructions
E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
E03 - water supply
E04 - building
E05 - locks
E06 - doors, windows, shutters, or roller blinds in general
E21 - earth drilling
E99 - subject matter not otherwise provided for in this section
F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

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Title: Method of thin film adhesion pretreatment

Abstract

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

Inventors:: Girardi, Michael

Issue Date:: Tue Sep 24 00:00:00 EDT 2019

Research Org.:: Kansas City Plant (KCP), Kansas City, MO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1576297

Patent Number(s):: 10426043

Application Number:: 15/241,336

Assignee:: Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)

Patent Classifications (CPCs):: H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/0298 - {Multilayer circuits}
H05K1/0306 - {Inorganic insulating substrates, e.g. ceramic, glass}
H05K2201/0317 - Thin film conductor layer
H05K2203/0522 - Using an adhesive pattern
H05K2203/0585 - Second resist used as mask for selective stripping of first resist
H05K2203/092 - Particle beam, e.g. using an electron beam or an ion beam
H05K3/0017 - {Etching of the substrate by chemical or physical means}
H05K3/027 - {the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}
H05K3/146 - {By vapour deposition}
H05K3/16 - by cathodic sputtering
H05K3/381 - {by special treatment of the substrate}

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DOE Contract Number:: NA0000622

Resource Type:: Patent

Resource Relation:: Patent File Date: 2016 Aug 19

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 97 MATHEMATICS AND COMPUTING; 36 MATERIALS SCIENCE

Citation Formats


                    Girardi, Michael. Method of thin film adhesion pretreatment.  United States: N. p., 2019. 
        Web.

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                    Girardi, Michael. Method of thin film adhesion pretreatment.  United States.

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                    Girardi, Michael. Tue .  
        "Method of thin film adhesion pretreatment".  United States.  https://www.osti.gov/servlets/purl/1576297.

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@article{osti_1576297,

  title        = {Method of thin film adhesion pretreatment},

  author       = {Girardi, Michael},

  abstractNote = {A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Sep 24 00:00:00 EDT 2019},

  month        = {Tue Sep 24 00:00:00 EDT 2019}

}

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Works referenced in this record:

Method for producing magnetic recording medium, and magnetic recording/reproducing apparatus
patent, October 2013

Fukushima, Masato; Sakawaki, Akira; Yamane, Akira
US Patent Document 8,551,349
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8551349

Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
patent, December 1994

Desaigoudar, Chan M.; Gupta, Suren
US Patent Document 5,370,766
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/5370766

Process for making magnetic recording medium and magnetic recording-reproducing apparatus
patent, December 2012

Fukushima, Masato; Sakawaki, Akira; Yamane, Akira
US Patent Document 8,336,193
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8336193

Circuit Substrate Structure and Manufacturing Method Thereof
patent-application, July 2013

Chiang, Cheng-Feng; Chiang, Jung-Chuan
US Patent Application 13/533702; 20130180773
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20130180773

MEMS Probe Card and Manufacturing Method Thereof
patent-application, April 2011

Kim, Sanghee
US Patent Application 12/988857; 20110089967
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20110089967

Electron Induced Chemical Etching for Device Level Diagnosis
patent-application, January 2008

Williamson, Mark J.; Sandhu, Gurtej S.; Arrington, Justin R.
US Patent Application 11/483878; 20080009140
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20080009140

Method to reduce photoresist pattern collapse by controlled surface microroughening
patent, June 2007

Brodsky, Colin J.; Bukofsky, Scott; Goldfarb, Dario L.
US Patent Document 7,229,936
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7229936

Phased array antenna using (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
patent, March 2006

Huff, Michael A.; Ozgur, Mehmet
US Patent Document 7,012,327
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7012327

Finger line screen printing method and apparatus
patent, August 1986

Shevtchuk, Victor; Chau, Nhut; Schuessler, Richard C.
US Patent Document 4,604,298
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4604298

Planarized ceramic substrates
patent, August 1988

Elias, Kenneth L.; Martin, Stuart R.; Slattery, William J.
US Patent Document 4,761,332
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/4761332

Circuit Board and Method of Forming Same
patent-application, February 2018

Girardi, Michael
US Patent Application 15/241336; 20180054899
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20180054899

Method of forming uniform features using photoresist
patent, July 2009

Camacho, Omar Eduardo Montero; Chen, Pei C.; Hwang, Cherngye
US Patent Document 7,560,225
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7560225

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Similar Records

Title: Method of thin film adhesion pretreatment

Abstract

Citation Formats

Method for producing magnetic recording medium, and magnetic recording/reproducing apparatus patent, October 2013

Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices patent, December 1994

Process for making magnetic recording medium and magnetic recording-reproducing apparatus patent, December 2012

Circuit Substrate Structure and Manufacturing Method Thereof patent-application, July 2013

MEMS Probe Card and Manufacturing Method Thereof patent-application, April 2011

Electron Induced Chemical Etching for Device Level Diagnosis patent-application, January 2008

Method to reduce photoresist pattern collapse by controlled surface microroughening patent, June 2007

Phased array antenna using (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates patent, March 2006

Finger line screen printing method and apparatus patent, August 1986

Planarized ceramic substrates patent, August 1988

Circuit Board and Method of Forming Same patent-application, February 2018

Method of forming uniform features using photoresist patent, July 2009

Method for producing magnetic recording medium, and magnetic recording/reproducing apparatus
patent, October 2013

Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices
patent, December 1994

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patent, December 2012

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patent-application, July 2013

MEMS Probe Card and Manufacturing Method Thereof
patent-application, April 2011

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patent, June 2007

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patent, August 1986

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patent, July 2009