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Title: Method of thin film adhesion pretreatment

Abstract

A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.

Inventors:
Issue Date:
Research Org.:
Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1576297
Patent Number(s):
10,426,043
Application Number:
15/241,336
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
DOE Contract Number:  
NA0000622
Resource Type:
Patent
Resource Relation:
Patent File Date: 2016 Aug 19
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 97 MATHEMATICS AND COMPUTING; 36 MATERIALS SCIENCE

Citation Formats

Girardi, Michael. Method of thin film adhesion pretreatment. United States: N. p., 2019. Web.
Girardi, Michael. Method of thin film adhesion pretreatment. United States.
Girardi, Michael. Tue . "Method of thin film adhesion pretreatment". United States. https://www.osti.gov/servlets/purl/1576297.
@article{osti_1576297,
title = {Method of thin film adhesion pretreatment},
author = {Girardi, Michael},
abstractNote = {A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {9}
}

Patent:

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Works referenced in this record:

Method for producing magnetic recording medium, and magnetic recording/reproducing apparatus
patent, October 2013


Process for making magnetic recording medium and magnetic recording-reproducing apparatus
patent, December 2012


Method to reduce photoresist pattern collapse by controlled surface microroughening
patent, June 2007


Finger line screen printing method and apparatus
patent, August 1986


Planarized ceramic substrates
patent, August 1988


Method of forming uniform features using photoresist
patent, July 2009