Title: Antenna-in-package structures with broadside and end-fire radiations

Abstract

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

Inventors:

Garcia, Alberto V.; Gu, Xiaoxiong Dong; Liu, Duixian

Issue Date:

2019-10-01

Research Org.:

International Business Machines Corp., Armonk, NY (United States)

Sponsoring Org.:

USDOE

OSTI Identifier:

1576265

Patent Number(s):

10431892

Application Number:

15/647,996

Assignee:

OSTI

Patent Classifications (CPCs):

G - PHYSICS G06 - COMPUTING G06K - RECOGNITION OF DATA

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

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G - PHYSICS G06 - COMPUTING G06K - RECOGNITION OF DATA

G06K19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K19/07749 - {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card}

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES

H01L2223/6677 - for antenna, e.g. antenna included within housing of semiconductor device
H01L2224/131 - with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2224/16225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L2224/16227 - the bump connector connecting to a bond pad of the item
H01L2224/17517 - including bump connectors providing primarily mechanical support
H01L2224/32013 - the layer connector being larger than the bonding area, e.g. bond pad
H01L2224/32014 - the layer connector being smaller than the bonding area, e.g. bond pad
H01L2224/32225 - the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L2224/33181 - On opposite sides of the body
H01L2224/73204 - the bump connector being embedded into the layer connector
H01L2224/73253 - Bump and layer connectors
H01L23/66 - High-frequency adaptations
H01L24/13 - {of an individual bump connector}
H01L24/16 - {of an individual bump connector}
H01L24/17 - {of a plurality of bump connectors}
H01L24/32 - {of an individual layer connector}
H01L24/33 - {of a plurality of layer connectors}
H01L2924/00 - Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00012 - Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
H01L2924/014 - Solder alloys
H01L2924/15192 - Resurf arrangement of the internal vias
H01L2924/15321 - being a ball array, e.g. BGA
H01L2924/15322 - being a pin array, e.g. PGA
H01L2924/3025 - Electromagnetic shielding

H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01Q - ANTENNAS, i.e. RADIO AERIALS

H01Q1/38 - formed by a conductive layer on an insulating support {
H01Q19/30 - the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
H01Q21/28 - Combinations of substantially independent non-interacting antenna units or systems {
H01Q23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
H01Q9/0407 - {Substantially flat resonant element parallel to ground plane, e.g. patch antenna

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Resource Type:

Patent

Resource Relation:

Patent File Date: 2017 Jul 12

Country of Publication:

United States

Language:

English