Antenna-in-package structures with broadside and end-fire radiations
Abstract
Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
- Inventors:
- Issue Date:
- Research Org.:
- International Business Machines Corp., Armonk, NY (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1576265
- Patent Number(s):
- 10431892
- Application Number:
- 15/647,996
- Assignee:
- OSTI
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2017 Jul 12
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Garcia, Alberto V., Gu, Xiaoxiong Dong, and Liu, Duixian. Antenna-in-package structures with broadside and end-fire radiations. United States: N. p., 2019.
Web.
Garcia, Alberto V., Gu, Xiaoxiong Dong, & Liu, Duixian. Antenna-in-package structures with broadside and end-fire radiations. United States.
Garcia, Alberto V., Gu, Xiaoxiong Dong, and Liu, Duixian. Tue .
"Antenna-in-package structures with broadside and end-fire radiations". United States. https://www.osti.gov/servlets/purl/1576265.
@article{osti_1576265,
title = {Antenna-in-package structures with broadside and end-fire radiations},
author = {Garcia, Alberto V. and Gu, Xiaoxiong Dong and Liu, Duixian},
abstractNote = {Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}
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