Heating and cooling devices, systems and related method
Abstract
Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1576252
- Patent Number(s):
- 10429105
- Application Number:
- 14/857,652
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F25 - REFRIGERATION OR COOLING F25B - REFRIGERATION MACHINES, PLANTS OR SYSTEMS
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- DOE Contract Number:
- AC04-94AL85000
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015 Sep 17
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; 59 BASIC BIOLOGICAL SCIENCES
Citation Formats
Kariya, Harumichi Arthur, Koplow, Jeffrey P., and Staats, Jr., Wayne Lawrence. Heating and cooling devices, systems and related method. United States: N. p., 2019.
Web.
Kariya, Harumichi Arthur, Koplow, Jeffrey P., & Staats, Jr., Wayne Lawrence. Heating and cooling devices, systems and related method. United States.
Kariya, Harumichi Arthur, Koplow, Jeffrey P., and Staats, Jr., Wayne Lawrence. Tue .
"Heating and cooling devices, systems and related method". United States. https://www.osti.gov/servlets/purl/1576252.
@article{osti_1576252,
title = {Heating and cooling devices, systems and related method},
author = {Kariya, Harumichi Arthur and Koplow, Jeffrey P. and Staats, Jr., Wayne Lawrence},
abstractNote = {Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {10}
}
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