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Title: Method and system for high performance real time pattern recognition

Abstract

Systems and methods supporting high performance real time pattern recognition by including time and regional multiplexing using high bandwidth, board-to-board communications channels, and 3D vertical integration. An array of processing boards can each be coupled a rear transition board, the array achieving time and regional multiplexing using high bandwidth board-to-board communications channels and 3D vertical integration.

Inventors:
; ;
Issue Date:
Research Org.:
Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568750
Patent Number(s):
10,387,365
Application Number:
15/737,151
Assignee:
Fermi Research Alliance, LLC (Batavia, IL)
DOE Contract Number:  
AC02-07CH11359
Resource Type:
Patent
Resource Relation:
Patent File Date: 06/17/2016
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 97 MATHEMATICS AND COMPUTING

Citation Formats

Olsen, Jamieson T., Liu, Tiehui Ted, and Hoff, James R. Method and system for high performance real time pattern recognition. United States: N. p., 2019. Web.
Olsen, Jamieson T., Liu, Tiehui Ted, & Hoff, James R. Method and system for high performance real time pattern recognition. United States.
Olsen, Jamieson T., Liu, Tiehui Ted, and Hoff, James R. Tue . "Method and system for high performance real time pattern recognition". United States. https://www.osti.gov/servlets/purl/1568750.
@article{osti_1568750,
title = {Method and system for high performance real time pattern recognition},
author = {Olsen, Jamieson T. and Liu, Tiehui Ted and Hoff, James R.},
abstractNote = {Systems and methods supporting high performance real time pattern recognition by including time and regional multiplexing using high bandwidth, board-to-board communications channels, and 3D vertical integration. An array of processing boards can each be coupled a rear transition board, the array achieving time and regional multiplexing using high bandwidth board-to-board communications channels and 3D vertical integration.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {8}
}

Patent:

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