Depositing bulk or micro-scale electrodes

Shah, Kedar G.; Pannu, Satinderpall S.; Tolosa, Vanessa; Tooker, Angela C.; Sheth, Heeral J.; Felix, Sarah H.; Delima, Terri L.

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Title: Depositing bulk or micro-scale electrodes

Abstract

Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.

Inventors:: Shah, Kedar G.; Pannu, Satinderpall S.; Tolosa, Vanessa; Tooker, Angela C.; Sheth, Heeral J.; Felix, Sarah H.; Delima, Terri L.

Issue Date:: 2019-07-02

Research Org.:: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1568540

Patent Number(s):: 10342128

Application Number:: 15/274,363

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Classifications (CPCs):: A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61N - ELECTROTHERAPY

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS

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A - HUMAN NECESSITIES A61 - MEDICAL OR VETERINARY SCIENCE A61N - ELECTROTHERAPY
A61N1/05 - for implantation or insertion into the body, e.g. heart electrode
A61N1/0553 - {Paddle shaped electrodes, e.g. for laminotomy}

H - ELECTRICITY H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR H05K - PRINTED CIRCUITS
H05K1/09 - Use of materials for the {conductive, e.g. } metallic pattern
H05K1/097 - {Inks comprising nanoparticles, i.e. inks which are sinterable at low temperatures}
H05K1/11 - Printed elements for providing electric connections to or between printed circuits
H05K2201/0338 - Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
H05K2201/099 - Coating over pads, e.g. solder resist partly over pads
H05K3/007 - {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
H05K3/12 - using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
H05K3/20 - by affixing prefabricated conductor pattern {
H05K3/28 - Applying non-metallic protective coatings {
H05K3/4007 - {Surface contacts, e.g. bumps

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T156/10 - Methods of surface bonding and/or assembly therefor
Y10T29/49147 - Assembling terminal to base

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DOE Contract Number:: AC52-07NA27344

Resource Type:: Patent

Resource Relation:: Patent File Date: 09/23/2016

Country of Publication:: United States

Language:: English

Subject:: 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 36 MATERIALS SCIENCE

Citation Formats


                    Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Depositing bulk or micro-scale electrodes.  United States: N. p., 2019. 
        Web.

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                    Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., & Delima, Terri L. Depositing bulk or micro-scale electrodes.  United States.

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                    Shah, Kedar G., Pannu, Satinderpall S., Tolosa, Vanessa, Tooker, Angela C., Sheth, Heeral J., Felix, Sarah H., and Delima, Terri L. Tue .  
        "Depositing bulk or micro-scale electrodes".  United States.  https://www.osti.gov/servlets/purl/1568540.

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@article{osti_1568540,

  title        = {Depositing bulk or micro-scale electrodes},

  author       = {Shah, Kedar G. and Pannu, Satinderpall S. and Tolosa, Vanessa and Tooker, Angela C. and Sheth, Heeral J. and Felix, Sarah H. and Delima, Terri L.},

  abstractNote = {Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {7}

}

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Works referenced in this record:

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Connolly, Patricia P.
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Insulated Implantable Electrical Circuit
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Implantable Electrodes for the Stimulation of the Sciatic Nerve
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Biosensor
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Tabada, Phillipe; Pannu, Satinderpall S.
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Methods of Bonding Microelectronic Elements
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URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20100200538

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Similar Records

Title: Depositing bulk or micro-scale electrodes

Abstract

Citation Formats

Wound Dressing with Impedance Sensor patent-application, July 2012

Ink Jet Printing of Implantable Electrodes patent-application, December 2010

Insulated Implantable Electrical Circuit patent-application, October 2006

Implantable Electrodes for the Stimulation of the Sciatic Nerve patent, June 1973

Biosensor patent-application, July 2004

Rigid Spine Reinforced Polymer Microelectrode Array Probe and Method of Fabrication patent-application, December 2010

Thermo-Compression Bonding of Metal to Semiconductors and the Like patent, October 1961

Methods of Bonding Microelectronic Elements patent-application, October 2002

Analyte Sensor and Fabrication Methods patent-application, August 2010

Wound Dressing with Impedance Sensor
patent-application, July 2012

Ink Jet Printing of Implantable Electrodes
patent-application, December 2010

Insulated Implantable Electrical Circuit
patent-application, October 2006

Implantable Electrodes for the Stimulation of the Sciatic Nerve
patent, June 1973

Biosensor
patent-application, July 2004

Rigid Spine Reinforced Polymer Microelectrode Array Probe and Method of Fabrication
patent-application, December 2010

Thermo-Compression Bonding of Metal to Semiconductors and the Like
patent, October 1961

Methods of Bonding Microelectronic Elements
patent-application, October 2002

Analyte Sensor and Fabrication Methods
patent-application, August 2010