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Title: Protected electrode structures and methods

Abstract

An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. The first protective layer may have a low mean peak to valley surface roughness and/or may be thin. In some embodiments, an interface between the first protective layer and the first electroactive material layer has a low mean peak to valley surface roughness.

Inventors:
; ;
Issue Date:
Research Org.:
Sion Power Corporation, Tucson, AZ (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568537
Patent Number(s):
10,333,134
Application Number:
15/635,443
Assignee:
Sion Power Corporation (Tucson, AZ)
DOE Contract Number:  
AR0000067
Resource Type:
Patent
Resource Relation:
Patent File Date: 06/28/2017
Country of Publication:
United States
Language:
English

Citation Formats

Mikhaylik, Yuriy V., Laramie, Michael G., and Kopera, John Joseph Christopher. Protected electrode structures and methods. United States: N. p., 2019. Web.
Mikhaylik, Yuriy V., Laramie, Michael G., & Kopera, John Joseph Christopher. Protected electrode structures and methods. United States.
Mikhaylik, Yuriy V., Laramie, Michael G., and Kopera, John Joseph Christopher. Tue . "Protected electrode structures and methods". United States. https://www.osti.gov/servlets/purl/1568537.
@article{osti_1568537,
title = {Protected electrode structures and methods},
author = {Mikhaylik, Yuriy V. and Laramie, Michael G. and Kopera, John Joseph Christopher},
abstractNote = {An electrode structure and its method of manufacture are disclosed. The disclosed electrode structures may be manufactured by depositing a first release layer on a first carrier substrate. A first protective layer may be deposited on a surface of the first release layer and a first electroactive material layer may then be deposited on the first protective layer. The first protective layer may have a low mean peak to valley surface roughness and/or may be thin. In some embodiments, an interface between the first protective layer and the first electroactive material layer has a low mean peak to valley surface roughness.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {6}
}

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