Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Dylia-Spears, Rebecca; Feit, Michael; Miller, Phillip E.; Steele, William A.; Suratwala, Tayyab I.; Wong, Lana L.

Title: Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Abstract

A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.

Inventors:: Dylia-Spears, Rebecca; Feit, Michael; Miller, Phillip E.; Steele, William A.; Suratwala, Tayyab I.; Wong, Lana L.

Issue Date:: 2019-05-14

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1568321

Patent Number(s):: 10287457

Application Number:: 14/437,453

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Classifications (CPCs):: C - CHEMISTRY C09 - DYES C09G - POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH

B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING

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C - CHEMISTRY C09 - DYES C09G - POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
C09G1/02 - containing abrasives or grinding agents {
C09G1/04 - Aqueous dispersions

B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
B24B37/04 - designed for working plane surfaces
B24B37/044 - {characterised by the composition of the lapping agent}

C - CHEMISTRY C09 - DYES C09K - MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
C09K3/1463 - {Aqueous liquid suspensions}
C09K3/1436 - {Composite particles, e.g. coated particles}

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DOE Contract Number:: AC52-07NA27344

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/16/2013

Country of Publication:: United States

Language:: English

Citation Formats


                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity.  United States: N. p., 2019. 
        Web.

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                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., & Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity.  United States.

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                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Tue .  
        "Polishing slurry preventing agglomeration of charged colloids without loss of surface activity".  United States.  https://www.osti.gov/servlets/purl/1568321.

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@article{osti_1568321,

  title        = {Polishing slurry preventing agglomeration of charged colloids without loss of surface activity},

  author       = {Dylia-Spears, Rebecca and Feit, Michael and Miller, Phillip E. and Steele, William A. and Suratwala, Tayyab I. and Wong, Lana L.},

  abstractNote = {A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {5}

}

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Title: Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Abstract

Citation Formats

CMP method and semiconductor manufacturing apparatus patent, May 2003

Particulate or particle-bound chelating agents patent, September 2008

Chemical mechanical polishing slurry for metal layers patent, June 1996

Cerium oxide abrasives for chemical mechanical polishing patent, May 2008

Polishing liquid and polishing method patent, January 2015

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Cerium oxide slurry, and method of manufacturing substrate patent, December 2004

Method of polishing a silicon-containing dielectric patent, July 2013

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CMP method and semiconductor manufacturing apparatus
patent, May 2003

Particulate or particle-bound chelating agents
patent, September 2008

Chemical mechanical polishing slurry for metal layers
patent, June 1996

Cerium oxide abrasives for chemical mechanical polishing
patent, May 2008

Polishing liquid and polishing method
patent, January 2015

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patent, March 2005

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patent, December 2006

Chemical mechanical polishing slurry for metal layers and films
patent, January 1999

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