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Title: Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Abstract

A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.

Inventors:
; ; ; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568321
Patent Number(s):
10287457
Application Number:
14/437,453
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
C - CHEMISTRY C09 - DYES C09G - POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 10/16/2013
Country of Publication:
United States
Language:
English

Citation Formats

Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity. United States: N. p., 2019. Web.
Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., & Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity. United States.
Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Tue . "Polishing slurry preventing agglomeration of charged colloids without loss of surface activity". United States. https://www.osti.gov/servlets/purl/1568321.
@article{osti_1568321,
title = {Polishing slurry preventing agglomeration of charged colloids without loss of surface activity},
author = {Dylia-Spears, Rebecca and Feit, Michael and Miller, Phillip E. and Steele, William A. and Suratwala, Tayyab I. and Wong, Lana L.},
abstractNote = {A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {5}
}

Works referenced in this record:

CMP method and semiconductor manufacturing apparatus
patent, May 2003


Particulate or particle-bound chelating agents
patent, September 2008


Chemical mechanical polishing slurry for metal layers
patent, June 1996


Cerium oxide abrasives for chemical mechanical polishing
patent, May 2008


Polishing liquid and polishing method
patent, January 2015


Method and System for Planarizing Integrated Circuit Material
patent-application, April 2005


Polishing Liquid
patent-application, April 2007


Aqueous Dispersion for Chemical Mechanical Polishing, Production Method Thereof, and Chemical Mechanical Polishing Method
patent-application, December 2009


High Selectivity and High Planarity Dielectric Polishing
patent-application, April 2004


Method of Manufacturing a Semiconductor Device
patent-application, May 2005


Method and system for planarizing integrated circuit material
patent, December 2006


Method of Manufacturing Semiconductor Device
patent-application, August 2004


Chemical mechanical polishing slurry for metal layers and films
patent, January 1999


Particulate or Particle-bound Chelating Agents
patent-application, April 2005


Semiconductor Device Manufacturing Method
patent-application, October 2009


Cerium Oxide Abrasives for Chemical Mechanical Polishing
patent-application, October 2006


Cerium oxide slurry, and method of manufacturing substrate
patent, December 2004


Process for Polishing a Silicon Surface by Means of a Cerium Oxide-Containing Dispersion
patent-application, May 2011


Method of polishing a silicon-containing dielectric
patent, July 2013


Polishing Slurry and Polished Substrate
patent-application, December 2023


Chemical mechanical polishing slurries for metal
patent, September 2002


Semiconductor Polishing Compound
patent-application, April 2008


Cerium Oxide Sol and Abrasive
patent-application, July 2002