Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Title: Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Abstract

A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.

Inventors:: Dylia-Spears, Rebecca; Feit, Michael; Miller, Phillip E.; Steele, William A.; Suratwala, Tayyab I.; Wong, Lana L.

Issue Date:: 2019-05-14

Research Org.:: Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1568321

Patent Number(s):: 10287457

Application Number:: 14/437,453

Assignee:: Lawrence Livermore National Security, LLC (Livermore, CA)

Patent Classifications (CPCs):: C - CHEMISTRY C09 - DYES C09G - POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH

B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING

Show more

C - CHEMISTRY C09 - DYES C09G - POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
C09G1/02 - containing abrasives or grinding agents {
C09G1/04 - Aqueous dispersions

B - PERFORMING OPERATIONS B24 - GRINDING B24B - MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
B24B37/04 - designed for working plane surfaces
B24B37/044 - {characterised by the composition of the lapping agent}

C - CHEMISTRY C09 - DYES C09K - MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
C09K3/1436 - {Composite particles, e.g. coated particles}
C09K3/1463 - {Aqueous liquid suspensions}

Show less

DOE Contract Number:: AC52-07NA27344

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/16/2013

Country of Publication:: United States

Language:: English

Citation Formats


                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity.  United States: N. p., 2019. 
        Web.

Copy to clipboard


                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., & Wong, Lana L. Polishing slurry preventing agglomeration of charged colloids without loss of surface activity.  United States.

Copy to clipboard


                    Dylia-Spears, Rebecca, Feit, Michael, Miller, Phillip E., Steele, William A., Suratwala, Tayyab I., and Wong, Lana L. Tue .  
        "Polishing slurry preventing agglomeration of charged colloids without loss of surface activity".  United States.  https://www.osti.gov/servlets/purl/1568321.

Copy to clipboard


                    
@article{osti_1568321,

  title        = {Polishing slurry preventing agglomeration of charged colloids without loss of surface activity},

  author       = {Dylia-Spears, Rebecca and Feit, Michael and Miller, Phillip E. and Steele, William A. and Suratwala, Tayyab I. and Wong, Lana L.},

  abstractNote = {A method for chemically stabilizing polishing slurries in aqueous suspension to prevent their agglomeration while maintaining their surface activity is disclosed. The method prevents the formation of irreversible particle agglomerates during drying and permits the subsequent re-suspension of dried particles with no impact on the particle size distribution. The stabilization method can be customized based on knowledge of the colloid surface charge at suspension pH conditions, addition of a charged species having like charge to the colloid at the suspension conditions, and control of the concentrations of the charged species and other ions in suspension.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2019},

  month        = {5}

}

Copy to clipboard

Patent:

View Patent

Save / Share:

Export Metadata

Save to My Library

Works referenced in this record:

CMP method and semiconductor manufacturing apparatus
patent, May 2003

Tateyama, Yoshikuni; Hirano, Tomoyuki
US Patent Document 6,561,876
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6561876

Particulate or particle-bound chelating agents
patent, September 2008

Small, Robert J.; Frey, Donald William; Tredinnick, Bruce
US Patent Document 7,427,361
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7427361

Chemical mechanical polishing slurry for metal layers
patent, June 1996

Neville, Matthew; Fluck, David J.; Hung, Cheng-Hung
US Patent Document 5,527,423
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5527423

Cerium oxide abrasives for chemical mechanical polishing
patent, May 2008

Small, Robert J.; Hayden, Christopher G.
US Patent Document 7,368,388
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7368388

Polishing liquid and polishing method
patent, January 2015

Kamimura, Tetsuya
US Patent Document 8,932,479
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=8932479

High selectivity and high planarity dielectric polishing
patent, March 2005

Singh, Rajiv K.
US Patent Document 6,866,793
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6866793

Method and system for planarizing integrated circuit material
patent, December 2006

Kim, Kwang-Bok; Choi, Jae-Kwang; Ko, Yong-Sun
US Patent Document 7,144,301
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7144301

Chemical mechanical polishing slurry for metal layers and films
patent, January 1999

Scherber, Debra L.; Kaufman, Vlasta Brusic; Kistler, Rodney C.
US Patent Document 5,858,813
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=5858813

Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
patent, January 2017

Mishra, Abhudaya; Wang, Luling
US Patent Document 9,558,959
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=9558959

Cerium oxide slurry, and method of manufacturing substrate
patent, December 2004

Nojo, Haruki; Yoshida, Akitoshi; Berar, Pascal
US Patent Document 6,827,752
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6827752

Method of polishing a silicon-containing dielectric
patent, July 2013

Carter, Phillip W.; Johns, Timothy P.
US Patent Document 8,486,169
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=8486169

Chemical mechanical polishing slurries for metal
patent, September 2002

Lack, Craig D.; Luo, Qiuliang; Ye, Qianqiu (Christine)
US Patent Document 6,447,373
URL: http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=6447373

Similar Records in DOE Patents and OSTI.GOV collections:

Multi-stage slurry system used for grinding and polishing materials

Patent Hed, P Paul [San Ramon, CA]; Fuchs, Baruch A [Aventura, FL]

A slurry system draws slurry from a slurry tank via one of several intake pipes, where each pipe has an intake opening at a different depth in the slurry. The slurry is returned to the slurry tank via a bypass pipe in order to continue the agitation of the slurry. The slurry is then diverted to a delivery pipe, which supplies slurry to a polisher. The flow of slurry in the bypass pipe is stopped in order for the slurry in the slurry tank to begin to settle. As the polishing continues, slurry is removed from shallower depths in ordermore »« less
Full Text Available
Charged particle detectors with active detector surface for partial energy deposition of the charged particles and related methods

Patent Gerts, David W; Bean, Robert S; Metcalf, Richard R

A radiation detector is disclosed. The radiation detector comprises an active detector surface configured to generate charge carriers in response to charged particles associated with incident radiation. The active detector surface is further configured with a sufficient thickness for a partial energy deposition of the charged particles to occur and permit the charged particles to pass through the active detector surface. The radiation detector further comprises a plurality of voltage leads coupled to the active detector surface. The plurality of voltage leads is configured to couple to a voltage source to generate a voltage drop across the active detector surfacemore »« less
Full Text Available
Polishing compound for plastic surfaces

Patent Stowell, Michael S [New Ellenton, SC]

A polishing compound for plastic surfaces. The compound contains by weight approximately 4 to 17 parts at least one petroleum distillate lubricant, 1 to 6 parts mineral spirits, 2.5 to 15 parts abrasive particles, and 2.5 to 10 parts water. The abrasive is tripoli or a similar material that contains fine particles silica. Preferably, most of the abrasive particles are less than approximately 10 microns, more preferably less than approximately 5 microns in size. The compound is used on PLEXIGLAS.TM., LEXAN.TM., LUCITE.TM., polyvinyl chloride (PVC) and similar plastic materials whenever a smooth, clear polished surface is desired.
Full Text Available
Apparatus and method for deterministic control of surface figure during full aperture polishing

Patent Suratwala, Tayyab Ishaq; Feit, Michael Dennis; Steele, William Augustus

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. Themore »« less
Full Text Available
Apparatus and method for deterministic control of surface figure during full aperture pad polishing

Patent Suratwala, Tayyab Ishaq; Feit, Michael Douglas; Steele, William Augustus

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. Themore »« less
Full Text Available

Similar Records

Title: Polishing slurry preventing agglomeration of charged colloids without loss of surface activity

Abstract

Citation Formats

CMP method and semiconductor manufacturing apparatus patent, May 2003

Particulate or particle-bound chelating agents patent, September 2008

Chemical mechanical polishing slurry for metal layers patent, June 1996

Cerium oxide abrasives for chemical mechanical polishing patent, May 2008

Polishing liquid and polishing method patent, January 2015

High selectivity and high planarity dielectric polishing patent, March 2005

Method and system for planarizing integrated circuit material patent, December 2006

Chemical mechanical polishing slurry for metal layers and films patent, January 1999

Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films patent, January 2017

Cerium oxide slurry, and method of manufacturing substrate patent, December 2004

Method of polishing a silicon-containing dielectric patent, July 2013

Chemical mechanical polishing slurries for metal patent, September 2002

CMP method and semiconductor manufacturing apparatus
patent, May 2003

Particulate or particle-bound chelating agents
patent, September 2008

Chemical mechanical polishing slurry for metal layers
patent, June 1996

Cerium oxide abrasives for chemical mechanical polishing
patent, May 2008

Polishing liquid and polishing method
patent, January 2015

High selectivity and high planarity dielectric polishing
patent, March 2005

Method and system for planarizing integrated circuit material
patent, December 2006

Chemical mechanical polishing slurry for metal layers and films
patent, January 1999

Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
patent, January 2017

Cerium oxide slurry, and method of manufacturing substrate
patent, December 2004

Method of polishing a silicon-containing dielectric
patent, July 2013

Chemical mechanical polishing slurries for metal
patent, September 2002