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Title: Lateral vias for connections to buried microconductors and methods thereof

Abstract

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.

Inventors:
; ; ; ; ; ; ; ; ;
Issue Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Varioscale, Inc., San Marcos, CA (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1568212
Patent Number(s):
10262931
Application Number:
15/980,546
Assignee:
National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM); Varioscale, Inc. (San Marcos, CA)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
NA0003525
Resource Type:
Patent
Resource Relation:
Patent File Date: 05/15/2018
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., Grubbs, Robert K., and Silverman, Scott. Lateral vias for connections to buried microconductors and methods thereof. United States: N. p., 2019. Web.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., Grubbs, Robert K., & Silverman, Scott. Lateral vias for connections to buried microconductors and methods thereof. United States.
Adams, David P., Fishgrab, Kira L., Greth, Karl Douglas, Henry, Michael David, Stevens, Jeffrey, Hodges, V. Carter, Shul, Randy J., Goeke, Ronald S., Grubbs, Robert K., and Silverman, Scott. Tue . "Lateral vias for connections to buried microconductors and methods thereof". United States. https://www.osti.gov/servlets/purl/1568212.
@article{osti_1568212,
title = {Lateral vias for connections to buried microconductors and methods thereof},
author = {Adams, David P. and Fishgrab, Kira L. and Greth, Karl Douglas and Henry, Michael David and Stevens, Jeffrey and Hodges, V. Carter and Shul, Randy J. and Goeke, Ronald S. and Grubbs, Robert K. and Silverman, Scott},
abstractNote = {The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}

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