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Title: Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits

Abstract

A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.

Inventors:
; ; ; ; ; ; ; ; ; ;
Issue Date:
Research Org.:
National Aeronautics and Space Administration (NASA), Washington, DC (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1568187
Patent Number(s):
10256202
Application Number:
15/880,139
Assignee:
The United States of America as represented by the Administrator of the National Aeronautics and Space Administration (Washington, DC)
Patent Classifications (CPCs):
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
Resource Type:
Patent
Resource Relation:
Patent File Date: 01/25/2018
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING

Citation Formats

Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., and Laster, Kimala L. Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits. United States: N. p., 2019. Web.
Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., & Laster, Kimala L. Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits. United States.
Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., and Laster, Kimala L. Tue . "Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits". United States. https://www.osti.gov/servlets/purl/1568187.
@article{osti_1568187,
title = {Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits},
author = {Spry, David J. and Lukco, Dorothy and Neudeck, Philip G. and Chang, Carl W. and Chen, Liangyu and Meredith, Roger D. and Moses, Kelley M. and Blaha, Charles A. and Gonzalez, Jose M. and Beheim, Glenn M. and Laster, Kimala L.},
abstractNote = {A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}

Works referenced in this record:

Method of making contacts on an integrated circuit
patent, August 1999


Electronic component package and method for forming same
patent, September 2016


Bonding pad and method for manufacturing it
patent, July 2002


Protection for bonding pads and methods of formation
patent, January 2011


Bond pad structure to reduce bond pad corrosion
patent, March 2015


Iridium interfacial stack (IRIS)
patent, April 2015