Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits
Abstract
A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.
- Inventors:
- Issue Date:
- Research Org.:
- National Aeronautics and Space Administration (NASA), Washington, DC (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1568187
- Patent Number(s):
- 10256202
- Application Number:
- 15/880,139
- Assignee:
- The United States of America as represented by the Administrator of the National Aeronautics and Space Administration (Washington, DC)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 01/25/2018
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., and Laster, Kimala L. Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits. United States: N. p., 2019.
Web.
Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., & Laster, Kimala L. Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits. United States.
Spry, David J., Lukco, Dorothy, Neudeck, Philip G., Chang, Carl W., Chen, Liangyu, Meredith, Roger D., Moses, Kelley M., Blaha, Charles A., Gonzalez, Jose M., Beheim, Glenn M., and Laster, Kimala L. Tue .
"Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits". United States. https://www.osti.gov/servlets/purl/1568187.
@article{osti_1568187,
title = {Durable bond pad structure for electrical connection to extreme environment microelectronic integrated circuits},
author = {Spry, David J. and Lukco, Dorothy and Neudeck, Philip G. and Chang, Carl W. and Chen, Liangyu and Meredith, Roger D. and Moses, Kelley M. and Blaha, Charles A. and Gonzalez, Jose M. and Beheim, Glenn M. and Laster, Kimala L.},
abstractNote = {A durable bond pad structure is described that facilitates highly durable electrical connections to semiconductor microelectronics chips (e.g., silicon carbide (SiC) chips) to enable prolonged operation over very extreme temperature ranges.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2019},
month = {4}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.