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Title: Direct imprinting of porous substrates

Abstract

Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates (“DIPS”), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.

Inventors:
; ; ;
Issue Date:
Research Org.:
Vanderbilt Univ., Nashville, TN (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1532161
Patent Number(s):
9352543
Application Number:
12/790,908
Assignee:
Vanderbilt University (Nashville, TN)
Patent Classifications (CPCs):
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
B - PERFORMING OPERATIONS B29 - WORKING OF PLASTICS B29D - PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
Resource Type:
Patent
Resource Relation:
Patent File Date: 2010-05-31
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Weiss, Sharon M., Ryckman, Judson D., Liscidini, Marco, and Sipe, John E. Direct imprinting of porous substrates. United States: N. p., 2016. Web.
Weiss, Sharon M., Ryckman, Judson D., Liscidini, Marco, & Sipe, John E. Direct imprinting of porous substrates. United States.
Weiss, Sharon M., Ryckman, Judson D., Liscidini, Marco, and Sipe, John E. Tue . "Direct imprinting of porous substrates". United States. https://www.osti.gov/servlets/purl/1532161.
@article{osti_1532161,
title = {Direct imprinting of porous substrates},
author = {Weiss, Sharon M. and Ryckman, Judson D. and Liscidini, Marco and Sipe, John E.},
abstractNote = {Provided are methods of patterning porous materials on the micro- and nanometer scale using a direct imprinting technique. The present methods of direct imprinting of porous substrates (“DIPS”), can utilize reusable stamps that may be directly applied to an underlying porous material to selectively, mechanically deform and/or crush particular regions of the porous material, creating a desired structure. The process can be performed in a matter of seconds, at room temperature or higher temperatures, and eliminates the requirement for intermediate masking materials and etching chemistries.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2016},
month = {5}
}

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