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Title: Ground-referenced single-ended system-on-package

Abstract

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.

Inventors:
; ; ; ;
Issue Date:
Research Org.:
NVIDIA Corp., Santa Clara, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1532139
Patent Number(s):
9171607
Application Number:
13/938,161
Assignee:
NVIDIA Corporation (Santa Clara, CA)
Patent Classifications (CPCs):
G - PHYSICS G11 - INFORMATION STORAGE G11C - STATIC STORES
H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
DOE Contract Number:  
B599861
Resource Type:
Patent
Resource Relation:
Patent File Date: 2013-07-09
Country of Publication:
United States
Language:
English

Citation Formats

Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, and Gray, Carl Thomas. Ground-referenced single-ended system-on-package. United States: N. p., 2015. Web.
Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, & Gray, Carl Thomas. Ground-referenced single-ended system-on-package. United States.
Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, and Gray, Carl Thomas. Tue . "Ground-referenced single-ended system-on-package". United States. https://www.osti.gov/servlets/purl/1532139.
@article{osti_1532139,
title = {Ground-referenced single-ended system-on-package},
author = {Dally, William J. and Poulton, John W. and Greer, III, Thomas Hastings and Khailany, Brucek Kurdo and Gray, Carl Thomas},
abstractNote = {A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2015},
month = {10}
}

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Works referenced in this record:

Regulated inverting power supply
patent, September 2000


Ground Referenced Single-Ended Signaling
patent-application, February 2014


Charge domain filter and method thereof
patent, April 2014


Semiconductor chip and multi-chip package
patent, August 2010


On-package multiprocessor ground-referenced single-ended interconnect
patent, October 2014


Ground referenced single-ended signaling
patent, December 2013


Circuit with programmable signal bandwidth and method thereof
patent, June 2011


Incorporating an independent logic block in a system-on-a-chip
patent, March 2013


Multi-chip build-up package of optoelectronic chip
patent, October 2008


Uniform multi-chip identification and routing system
patent, December 2013


Ground-Referenced Single-Ended Memory Interconnect
patent-application, September 2014


Systems and methods for control with a multi-chip module with multiple dies
patent, September 2013


    Works referencing / citing this record:

    Data-driven charge-pump transmitter for differential signaling
    patent, May 2016