Ground-referenced single-ended system-on-package

Dally, William J.; Poulton, John W.; Greer, Thomas Hastings; Khailany, Brucek Kurdo; Gray, Carl Thomas

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
A43 - footwear
A44 - haberdashery
A45 - hand or travelling articles
A46 - brushware
A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
B26 - hand cutting tools
B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
B41 - printing
B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
B61 - railways
B62 - land vehicles for travelling otherwise than on rails
B63 - ships or other waterborne vessels
B64 - aircraft
B65 - conveying
B66 - hoisting
B67 - opening, closing {or cleaning} bottles, jars or similar containers
B68 - saddlery
B81 - microstructural technology
B82 - nanotechnology
B99 - subject matter not otherwise provided for in this section
C - chemistry
C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
C03 - glass
C04 - cements
C05 - fertilisers
C06 - explosives
C07 - organic chemistry
C08 - organic macromolecular compounds
C09 - dyes
C10 - petroleum, gas or coke industries
C11 - animal or vegetable oils, fats, fatty substances or waxes
C12 - biochemistry
C13 - sugar industry
C14 - skins
C21 - metallurgy of iron
C22 - metallurgy
C23 - coating metallic material
C25 - electrolytic or electrophoretic processes
C30 - crystal growth
C40 - combinatorial technology
C99 - subject matter not otherwise provided for in this section
D - textiles
D01 - natural or man-made threads or fibres
D02 - yarns
D03 - weaving
D04 - braiding
D05 - sewing
D06 - treatment of textiles or the like
D07 - ropes
D10 - indexing scheme associated with sublasses of section d, relating to textiles
D21 - paper-making
D99 - subject matter not otherwise provided for in this section
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E01 - construction of roads, railways, or bridges
E02 - hydraulic engineering
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E04 - building
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F - mechanical engineering
F01 - machines or engines in general
F02 - combustion engines
F03 - machines or engines for liquids
F04 - positive - displacement machines for liquids
F05 - indexing schemes relating to engines or pumps in various subclasses of classes f01-f04
F15 - fluid-pressure actuators
F16 - engineering elements and units
F17 - storing or distributing gases or liquids
F21 - lighting
F22 - steam generation
F23 - combustion apparatus
F24 - heating
F25 - refrigeration or cooling
F26 - drying
F27 - furnaces
F28 - heat exchange in general
F41 - weapons
F42 - ammunition
F99 - subject matter not otherwise provided for in this section
G - physics
G01 - measuring
G02 - optics
G03 - photography
G04 - horology
G05 - controlling
G06 - computing
G07 - checking-devices
G08 - signalling
G09 - education
G10 - musical instruments
G11 - information storage
G12 - instrument details
G16 - information and communication technology [ict] specially adapted for specific application fields
G21 - nuclear physics
G99 - subject matter not otherwise provided for in this section
H - electricity
H01 - basic electric elements
H02 - generation
H03 - basic electronic circuitry
H04 - electric communication technique
H05 - electric techniques not otherwise provided for
H99 - subject matter not otherwise provided for in this section
Y - new / cross sectional technologies
Y02 - technologies or applications for mitigation or adaptation against climate change
Y04 - information or communication technologies having an impact on other technology areas
Y10 - technical subjects covered by former uspc

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Title: Ground-referenced single-ended system-on-package

Abstract

A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.

Inventors:: Dally, William J.; Poulton, John W.; Greer, III, Thomas Hastings; Khailany, Brucek Kurdo; Gray, Carl Thomas

Issue Date:: 2015-10-27

Research Org.:: NVIDIA Corp., Santa Clara, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1532139

Patent Number(s):: 9171607

Application Number:: 13/938,161

Assignee:: NVIDIA Corporation (Santa Clara, CA)

Patent Classifications (CPCs):: G - PHYSICS G11 - INFORMATION STORAGE G11C - STATIC STORES

H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION

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G - PHYSICS G11 - INFORMATION STORAGE G11C - STATIC STORES
G11C11/4096 - Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
G11C7/1057 - {Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load}
G11C7/1069 - {I/O lines read out arrangements

H - ELECTRICITY H04 - ELECTRIC COMMUNICATION TECHNIQUE H04L - TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
H04L25/0276 - {Arrangements for coupling common mode signals}

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DOE Contract Number:: B599861

Resource Type:: Patent

Resource Relation:: Patent File Date: 2013-07-09

Country of Publication:: United States

Language:: English

Citation Formats


                    Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, and Gray, Carl Thomas. Ground-referenced single-ended system-on-package.  United States: N. p., 2015. 
        Web.

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                    Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, & Gray, Carl Thomas. Ground-referenced single-ended system-on-package.  United States.

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                    Dally, William J., Poulton, John W., Greer, III, Thomas Hastings, Khailany, Brucek Kurdo, and Gray, Carl Thomas. Tue .  
        "Ground-referenced single-ended system-on-package".  United States.  https://www.osti.gov/servlets/purl/1532139.

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@article{osti_1532139,

  title        = {Ground-referenced single-ended system-on-package},

  author       = {Dally, William J. and Poulton, John W. and Greer, III, Thomas Hastings and Khailany, Brucek Kurdo and Gray, Carl Thomas},

  abstractNote = {A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a system function chip, and an MCM package configured to include the first processor chip and the system function chip. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. The system function chip is configured to include a second GRS interface circuit. A first set of electrical traces are fabricated within the MCM package and coupled to the first GRS interface circuit and to the second GRS interface circuit. The first GRS interface circuit and second GRS interface circuit together provide a communication channel between the first processor chip and the system function chip.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2015},

  month        = {10}

}

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Works referencing / citing this record:

Data-driven charge-pump transmitter for differential signaling
patent, May 2016

Poulton, John W.; Greer, III, Thomas Hastings; Dally, William J.
US Patent Document 9,338,036
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/9338036

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Title: Ground-referenced single-ended system-on-package

Abstract

Citation Formats

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Ground-Referenced Single-Ended Signaling Connected Graphics Processing Unit Multi-Chip Module patent-application, September 2014

Regulated inverting power supply patent, September 2000

Semiconductor integrated circuit for use in direct memory access patent-application, October 2003

Offset compensation in local-probe data storage devices patent-application, September 2005

Ground-Referenced Single-Ended Signaling Connected Graphics Processing Unit Multi-Chip Module patent-application, September 2014

Switched-Capacitor Charge Pumps patent-application, September 2010

Rank sparing system and method patent-application, January 2009

Switched-Capacitor Regulators patent-application, September 2008

Ground Referenced Single-Ended Signaling patent-application, February 2014

Signal Processing Circuit patent-application, June 2012

Multi-Tap Direct Sub-sampling Mixing System for Wireless Receivers patent-application, January 2009

Duty detection circuit and method for controlling the same patent-application, October 2006

Charge domain filter and method thereof patent, April 2014

Semiconductor chip and multi-chip package patent, August 2010

Multi-Chip Build-Up Package of Optoelectronic Chip patent-application, July 2007

Multi-output power supply device having charge pump circuit patent, January 2012

Ground Referenced Single-Ended Signaling patent-application, August 2013

Semiconductor chip and multi-chip package patent-application, February 2007

On-package multiprocessor ground-referenced single-ended interconnect patent, October 2014

Ground-Referenced Single-Ended Memory Interconnect patent-application, September 2014

Method and System for Accessing a Flash Memory Device patent-application, July 2013

Thin multichip flex-module patent-application, September 2007

Multi-Phase Ground-Referenced Single-Ended Signaling patent-application, September 2014

Ground referenced single-ended signaling patent, December 2013

3D IC Structure and Method patent-application, April 2014

Single-ended memory interface system patent-application, November 2003

On-Package Multiprocessor Ground-Referenced Single-Ended Interconnect patent-application, September 2014

Multiple sampling sample and hold architectures patent-application, September 2007

Sense Amplifier for Flash Memory patent-application, February 2014

Device Access System patent-application, June 2013

Filter Automatic Adjustment Circuit and Method for Adjusting Characteristic Frequency of Filter and Wireless Communication Apparatus Provided with the Same patent-application, June 2011

Methods for Stacking Wire-Bonded Integrated Circuit Dice on Flip-Chip Bonded Integrated Circuit Dice patent-application, December 2008

Direct Sampling Circuit and Receiver patent-application, August 2011

Semiconductor integrated circuit and system of controlling the same patent, March 2013

Incorporating an Independent Logic Block in a System-on-a-Chip patent-application, March 2012

Negative Voltage Generators patent-application, December 2013

Three-Dimensional Stacked Structure Semiconductor Device Having Through-Silicon Via and Signaling Method for the Semiconductor Device patent-application, December 2011

Semiconductor Memory Device and Manufacturing the Same patent-application, September 2011

Multimodal memory controllers patent-application, August 2008

Circuit with programmable signal bandwidth and method thereof patent, June 2011

Incorporating an independent logic block in a system-on-a-chip patent, March 2013

Self-Oscillating Regulated Low-Ripple Charge Pump and Method patent-application, July 2009

Power Control for Information Handling System Having Shared Resources patent-application, February 2012

Multi-chip build-up package of optoelectronic chip patent, October 2008

Data-Driven Charge-Pump Transmitter for Differential Signaling patent-application, August 2013

Uniform multi-chip identification and routing system patent, December 2013

High Speed Memory Architecture patent-application, February 2010

Ground-Referenced Single-Ended Memory Interconnect patent-application, September 2014

Systems and methods for control with a multi-chip module with multiple dies patent, September 2013

Optical transmission module patent-application, June 2004

Power control for information handling system having shared resources patent, November 2013

Adjusting for Charge Loss in a Memory patent-application, August 2010

Method for reducing tuning etch in a clock-forwarded interface patent-application, August 2002

Storage Apparatus and Data Control Method patent-application, April 2012

Data-driven charge-pump transmitter for differential signaling patent, May 2016

Parallel Array Architecture for a Graphics Processor
patent-application, July 2007

Ground-Referenced Single-Ended Signaling Connected Graphics Processing Unit Multi-Chip Module
patent-application, September 2014

Regulated inverting power supply
patent, September 2000

Semiconductor integrated circuit for use in direct memory access
patent-application, October 2003

Offset compensation in local-probe data storage devices
patent-application, September 2005

Ground-Referenced Single-Ended Signaling Connected Graphics Processing Unit Multi-Chip Module
patent-application, September 2014

Switched-Capacitor Charge Pumps
patent-application, September 2010

Rank sparing system and method
patent-application, January 2009

Switched-Capacitor Regulators
patent-application, September 2008

Ground Referenced Single-Ended Signaling
patent-application, February 2014

Signal Processing Circuit
patent-application, June 2012

Multi-Tap Direct Sub-sampling Mixing System for Wireless Receivers
patent-application, January 2009

Duty detection circuit and method for controlling the same
patent-application, October 2006

Charge domain filter and method thereof
patent, April 2014

Semiconductor chip and multi-chip package
patent, August 2010

Multi-Chip Build-Up Package of Optoelectronic Chip
patent-application, July 2007

Multi-output power supply device having charge pump circuit
patent, January 2012

Ground Referenced Single-Ended Signaling
patent-application, August 2013

Semiconductor chip and multi-chip package
patent-application, February 2007

On-package multiprocessor ground-referenced single-ended interconnect
patent, October 2014

Ground-Referenced Single-Ended Memory Interconnect
patent-application, September 2014

Method and System for Accessing a Flash Memory Device
patent-application, July 2013

Thin multichip flex-module
patent-application, September 2007

Multi-Phase Ground-Referenced Single-Ended Signaling
patent-application, September 2014

Ground referenced single-ended signaling
patent, December 2013

3D IC Structure and Method
patent-application, April 2014

Single-ended memory interface system
patent-application, November 2003

On-Package Multiprocessor Ground-Referenced Single-Ended Interconnect
patent-application, September 2014

Multiple sampling sample and hold architectures
patent-application, September 2007

Sense Amplifier for Flash Memory
patent-application, February 2014

Device Access System
patent-application, June 2013

Filter Automatic Adjustment Circuit and Method for Adjusting Characteristic Frequency of Filter and Wireless Communication Apparatus Provided with the Same
patent-application, June 2011

Methods for Stacking Wire-Bonded Integrated Circuit Dice on Flip-Chip Bonded Integrated Circuit Dice
patent-application, December 2008

Direct Sampling Circuit and Receiver
patent-application, August 2011

Semiconductor integrated circuit and system of controlling the same
patent, March 2013

Incorporating an Independent Logic Block in a System-on-a-Chip
patent-application, March 2012

Negative Voltage Generators
patent-application, December 2013

Three-Dimensional Stacked Structure Semiconductor Device Having Through-Silicon Via and Signaling Method for the Semiconductor Device
patent-application, December 2011

Semiconductor Memory Device and Manufacturing the Same
patent-application, September 2011

Multimodal memory controllers
patent-application, August 2008

Circuit with programmable signal bandwidth and method thereof
patent, June 2011

Incorporating an independent logic block in a system-on-a-chip
patent, March 2013

Self-Oscillating Regulated Low-Ripple Charge Pump and Method
patent-application, July 2009

Power Control for Information Handling System Having Shared Resources
patent-application, February 2012

Multi-chip build-up package of optoelectronic chip
patent, October 2008

Data-Driven Charge-Pump Transmitter for Differential Signaling
patent-application, August 2013

Uniform multi-chip identification and routing system
patent, December 2013

High Speed Memory Architecture
patent-application, February 2010

Ground-Referenced Single-Ended Memory Interconnect
patent-application, September 2014

Systems and methods for control with a multi-chip module with multiple dies
patent, September 2013

Optical transmission module
patent-application, June 2004

Power control for information handling system having shared resources
patent, November 2013

Adjusting for Charge Loss in a Memory
patent-application, August 2010

Method for reducing tuning etch in a clock-forwarded interface
patent-application, August 2002

Storage Apparatus and Data Control Method
patent-application, April 2012

Data-driven charge-pump transmitter for differential signaling
patent, May 2016