Methods for forming pitting resistant carbon coating
Abstract
A method for making a pitting resistant carbon coating that includes a hydrogenated diamond-like coating (“H-DLC”). The H-DLC is relatively soft and elastic. Unlike hard and/or inelastic coatings in the prior art, the present coatings do not exhibit a loss of adhesion (delamination). A bonding layer may be deposited on a metallic substrate and the deposited H-DLC on the bonding layer.
- Inventors:
- Issue Date:
- Research Org.:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1532059
- Patent Number(s):
- 9,926,622
- Application Number:
- 14/939,604
- Assignee:
- UChicago Argonne, LLC (Chicago, IL)
- DOE Contract Number:
- AC02-06CH11357
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2015-11-12
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
Citation Formats
Erylimaz, Osman L., Singh, Harpal, Greco, Aaron C., Ramirez Gonzalez, Jair G., and Erdemir, Ali. Methods for forming pitting resistant carbon coating. United States: N. p., 2018.
Web.
Erylimaz, Osman L., Singh, Harpal, Greco, Aaron C., Ramirez Gonzalez, Jair G., & Erdemir, Ali. Methods for forming pitting resistant carbon coating. United States.
Erylimaz, Osman L., Singh, Harpal, Greco, Aaron C., Ramirez Gonzalez, Jair G., and Erdemir, Ali. Tue .
"Methods for forming pitting resistant carbon coating". United States. https://www.osti.gov/servlets/purl/1532059.
@article{osti_1532059,
title = {Methods for forming pitting resistant carbon coating},
author = {Erylimaz, Osman L. and Singh, Harpal and Greco, Aaron C. and Ramirez Gonzalez, Jair G. and Erdemir, Ali},
abstractNote = {A method for making a pitting resistant carbon coating that includes a hydrogenated diamond-like coating (“H-DLC”). The H-DLC is relatively soft and elastic. Unlike hard and/or inelastic coatings in the prior art, the present coatings do not exhibit a loss of adhesion (delamination). A bonding layer may be deposited on a metallic substrate and the deposited H-DLC on the bonding layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {3}
}
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