III-nitride transistor with trench gate
Abstract
A transistor includes a stack of III-nitride semiconductor layers, the stack having a frontside and a backside, a source electrode in contact with the frontside of the stack, a drain electrode in contact with the backside of the stack, a trench extending through a portion of the stack, the trench having a sidewall, and a gate structure formed in the trench, including an AlN layer formed on the sidewall of the trench, an insulating cap layer formed on the AlN layer, and a gate electrode formed on the insulator cap layer and covering the sidewall of the trench.
- Inventors:
- Issue Date:
- Research Org.:
- HRL Laboratories, LLC, Malibu, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1532041
- Patent Number(s):
- 9865725
- Application Number:
- 15/099,390
- Assignee:
- HRL Laboratories, LLC (Malibu, CA)
- Patent Classifications (CPCs):
-
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AR000450
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 2016-04-14
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING
Citation Formats
Chu, Rongming. III-nitride transistor with trench gate. United States: N. p., 2018.
Web.
Chu, Rongming. III-nitride transistor with trench gate. United States.
Chu, Rongming. Tue .
"III-nitride transistor with trench gate". United States. https://www.osti.gov/servlets/purl/1532041.
@article{osti_1532041,
title = {III-nitride transistor with trench gate},
author = {Chu, Rongming},
abstractNote = {A transistor includes a stack of III-nitride semiconductor layers, the stack having a frontside and a backside, a source electrode in contact with the frontside of the stack, a drain electrode in contact with the backside of the stack, a trench extending through a portion of the stack, the trench having a sidewall, and a gate structure formed in the trench, including an AlN layer formed on the sidewall of the trench, an insulating cap layer formed on the AlN layer, and a gate electrode formed on the insulator cap layer and covering the sidewall of the trench.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2018},
month = {1}
}
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